Low-Temperature Binder Film Sintering to Prevent Bonding Voids
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Solution Overview
Problem
Conventional film-shaped firing materials used for bonding semiconductor elements often result in sintered bodies with voids due to simultaneous decomposition and melting of the binder and metal particles at similar temperatures, leading to decreased thermal conductivity and thickness uniformity.
Innovation Solution
A film-shaped firing material comprising metal particles and a binder component with a resin having a decomposition initiation temperature of 200°C or less, specifically an aliphatic polycarbonate, is used to promote binder decomposition and vaporization before metal melting, allowing for dense aggregation and sintering without voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If sintering is carried out by heating and pressurizing the firing material at high temperature, then bonding strength is improved, but voids are generated inside the sintered body
Solution Approach 1:
The binder component is designed to decompose and vaporize at a lower temperature (200°C or less) before the metal particles melt, creating pores that facilitate gas escape during subsequent heating. This preliminary decomposition action prevents void formation when the metal particles later sinter at higher temperatures.
Solution Approach 2:
The invention changes the temperature parameter profile by using a binder with low decomposition temperature (200°C or less) that decomposes before the metal melting point. This creates a two-stage process: first binder decomposition creating open structure, then metal sintering without trapped gases, thereby achieving high bonding strength without voids.
2Manufacturing precision
If sintering is carried out at low temperature, then void formation is reduced, but bonding strength decreases
Solution Approach 1:
The invention changes the temperature parameter profile by using a binder with low decomposition temperature (200°C or less) that decomposes before the metal melting point. This creates a two-stage process: first binder decomposition creating open structure, then metal sintering without trapped gases, thereby achieving high bonding strength without voids.
Solution Approach 2:
The binder undergoes phase transition from solid to gas at low temperature (200°C or less) before the metal particles melt. This sequential phase transition ensures the binder decomposes completely first, creating an open porous structure that allows subsequent metal sintering to proceed without generating internal voids, while still achieving strong bonding.
3Stability of the object's composition
If the binder decomposition temperature is high, then thermal stability is improved, but voids are generated during sintering
Solution Approach 1:
The binder component is designed to decompose and vaporize at a lower temperature (200°C or less) before the metal particles melt, creating pores that facilitate gas escape during subsequent heating. This preliminary decomposition action prevents void formation when the metal particles later sinter at higher temperatures.
Solution Approach 2:
The invention changes the temperature parameter profile by using a binder with low decomposition temperature (200°C or less) that decomposes before the metal melting point. This creates a two-stage process: first binder decomposition creating open structure, then metal sintering without trapped gases, thereby achieving high bonding strength without voids.
4Manufacturing precision
If the binder decomposition temperature is low, then void formation is reduced, but thermal stability decreases
Solution Approach 1:
The invention changes the temperature parameter profile by using a binder with low decomposition temperature (200°C or less) that decomposes before the metal melting point. This creates a two-stage process: first binder decomposition creating open structure, then metal sintering without trapped gases, thereby achieving high bonding strength without voids.
Solution Approach 2:
The binder undergoes phase transition from solid to gas at low temperature (200°C or less) before the metal particles melt. This sequential phase transition ensures the binder decomposes completely first, creating an open porous structure that allows subsequent metal sintering to proceed without generating internal voids, while still achieving strong bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a sintered body with few voids, enhancing thermal conductivity and uniformity by ensuring metal particles maintain their shape and are easily bonded, thus efficiently releasing heat from semiconductor elements.
Implementation Method 1
a binder component that contains a resin having a decomposition initiation temperature of 200° C. or less
Implementation Method 2
promote binder decomposition and vaporization before metal melting
Implementation Method 3
metal particles; and a binder component... allowing for dense aggregation and sintering without voids
Data Source
AI summary
A film-shaped firing material for heating and pressurizing, the material including: metal particles; and a binder component that contains a resin having a decomposition initiation temperature of 200° C. or less.