Non-Macromolecular Adhesive Additives TRIZ Cases

Flaky metal-coated particles and smaller conductive fillers improve through-thickness heat dissipation while preserving EMI shielding.

A conductive paste with organic amine replaces scribing in perovskite solar modules, reducing decomposition defects and extending service life.

Controlled shear viscosity lets semiconductor adhesive film embed chips or wires in FOD/FOW packages while suppressing bleeding during bonding.

A hindered amine-stabilized curable adhesive sheet keeps bonding during heating yet releases workpieces cleanly for efficient dicing.

A resin-filler conductive adhesive replaces laser welding in lithium-ion battery tab bonding, improving shear strength, conductivity, and electrolyte stability.

A two-component polyurethane adhesive uses tailored prepolymers and fillers to improve heat transfer without losing bond strength or flame resistance.

A metal mesh on a transparent substrate cuts glass-related signal loss while preserving vehicle styling for 5G and V2X use.

A tailored (meth)acrylate temporary bonding composition cuts spin-coating air bubbles while maintaining wafer flatness, heat resistance, and release.

Organic amine conductive paste replaces laser scribing in perovskite modules, reducing decomposition defects and extending service life.

A low-decomposition binder film clears gases before metal sintering, reducing voids while preserving bond strength and heat conduction.

A multilayer protective sheet conforms to bumped chip surfaces, survives high heat, and peels off cleanly after reflow or sputtering.

Temperature-sensitive microparticles in the adhesive layer let windows and translucent roofs self-adjust cloudiness without complex laminated dimming structures.

Alumina and diamond fillers in a die attach film raise thermal conductivity while preserving thickness uniformity in highly integrated packages.

Controlling particle content above 300 nm and keeping viscosity low lets epoxy underfill fill narrow chip gaps with fewer air holes and reliable bonding.

A filler-tuned multilayer polyolefin dicing tape cuts wafers with less linting, whiskers, and chipping while avoiding PVC contamination.

A two-component polyurethane with ATH, expandable graphite, and graphene balances heat transfer, cure speed, and bond strength for EV battery compartments.

An organoaluminum complex helps nickel-filled epoxy adhesive overcome aluminum passivation and lower connection resistance in cured joints.

A phosphate-modified radical adhesive bonds punching-oil-covered steel plates, simplifying motor core lamination while maintaining strong adhesion.

UV-curable glass inks and primers improve adhesion, optical density, and curing throughput for thin opaque automotive display cover glass.