Polyolefin Dicing Tape Composition for Clean Wafer Cutting
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Solution Overview
Problem
Dicing films using polyolefin-based substrate layers suffer from issues such as linting, whisker formation, chip fly, and chipping during dicing, leading to poor quality cuts and reduced production yield, while also posing environmental concerns due to the use of PVC-based materials.
Innovation Solution
A dicing tape with a multilayer configuration comprising polyolefin-based copolymers and organic or inorganic fillers, produced through a multilayer blown film extrusion process, which minimizes whiskers and linting, and maintains mechanical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If polyolefin-based substrate layers are used in dicing films, then environmental contamination is avoided and mechanical performance is maintained, but linting, whisker formation, chip fly, and chipping occur during dicing
Solution Approach 1:
The patent applies composite materials by combining polyolefin resin with specific inorganic fillers (such as talc, silica, or calcium carbonate) in defined proportions. This composite structure maintains the environmental benefits of polyolefin while the filler particles suppress linting, whisker formation, and chipping during dicing, thereby improving cut quality without sacrificing environmental performance
Solution Approach 2:
The patent modifies the physical and chemical parameters of the polyolefin substrate by controlling resin molecular weight, filler particle size distribution, and filler-resin ratio. These parameter changes optimize the material's behavior during dicing, reducing defects like whiskers and lint while maintaining the non-contaminating properties of polyolefin materials
2Strength
If PVC-based substrate layers are used in dicing films, then excellent mechanical performance and thermal stability are achieved, but environmental contamination and chloride corrosion occur
Solution Approach 1:
The patent replicates the mechanical performance parameters of PVC-based films by carefully selecting polyolefin resin characteristics (molecular weight, branching structure) and optimizing filler content. This allows achieving comparable tensile strength and thermal stability without using PVC, thereby eliminating environmental contamination and chloride corrosion issues
Solution Approach 2:
The patent uses composite materials comprising polyolefin resin and inorganic fillers to substitute PVC-based substrates. The composite structure provides the necessary mechanical strength and thermal stability that PVC traditionally offered, while avoiding the harmful environmental effects of chlorine-containing materials
3Area of stationary object
If dicing films are expanded to separate wafers, then gap between cut semiconductor members is enlarged, but film toughness must be sufficient to avoid breakage
Solution Approach 1:
The patent adjusts the elastic modulus and tensile strength parameters of the polyolefin-based dicing film by modifying resin composition and filler content. These parameter changes enable the film to withstand expansion forces without breaking while creating sufficient gap between chips, resolving the contradiction between gap enlargement and film integrity
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
Described is a dicing tape comprising: a base layer, a first outer layer which is provided over the base layer and differs from the base layer, and an optional pressure-sensitive adhesive layer; wherein the base layer and the first outer layer comprise a polyolefin-based copolymer; and wherein the first outer layer comprises an organic or inorganic filler in an amount of 3 to 25 wt.-% based on the total weight of the respective layer. The dicing tape avoids the use of PVC-based substrate layers, exhibits excellent cutting properties during the dicing process (without whiskers, linting or chipping) and simultaneously ensures favourable mechanical performance. In other aspects, a dicing method, comprising the steps of: mounting a semiconductor wafer onto the aforementioned dicing tape, dicing the semiconductor wafer, and separating the wafer from the dicing tape is disclosed. Finally, a method of manufacturing the aforementioned dicing tape is described, wherein the dicing tape is produced by a multilayer blown film extrusion process.