Composite Die Attach Film for Heat Dissipation in Stacked Packages
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Solution Overview
Problem
The increasing heat accumulation in highly integrated semiconductor packages due to improved performance of semiconductor chips necessitates improved thermal conductivity and heat dissipation in die attach films to enhance integration and performance.
Innovation Solution
A die attach film with an adhesive layer containing alumina and diamond fillers dispersed throughout, providing a ratio of 70 to 85 parts by weight and a 2:1 to 3:1 ratio of alumina to diamond fillers, enhancing thermal conductivity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor package structure uses highly integrated and stacked chips to improve capacity and performance, then the integration and performance are improved, but heat accumulation increases
Solution Approach 1:
The die attach film uses a composite adhesive layer containing both alumina filler (70-85 parts by weight) and diamond filler (2:1 to 3:1 ratio of alumina to diamond) to create a material with enhanced thermal conductivity. This composite structure allows the adhesive layer to simultaneously provide bonding functionality and superior heat dissipation, directly addressing the heat accumulation problem in highly integrated semiconductor packages
2Temperature
If the die attach film uses adhesive layer with fillers to improve thermal conductivity, then heat dissipation is improved, but the adhesive layer may lose strength or become too soft
Solution Approach 1:
The patent optimizes the filler content parameter to 70-85 parts by weight based on 100 parts by weight of the adhesive layer, and sets the alumina to diamond filler ratio at 2:1 to 3:1. These specific parameter ranges ensure sufficient thermal conductivity enhancement while maintaining adequate mechanical strength and bonding performance of the adhesive layer
3Temperature
If high content of fillers is used in the adhesive layer to improve thermal conductivity, then heat dissipation is improved, but the adhesive layer thickness becomes non-uniform
Solution Approach 1:
The combination of alumina and diamond fillers in specific proportions creates a composite adhesive layer that maintains uniform thickness. The synergistic effect of the two fillers with different properties allows high filler content (70-85 parts) while preserving thickness uniformity and bonding performance, overcoming the limitation of using single filler types at high concentrations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The die attach film significantly improves thermal conductivity, maintaining uniform thickness and supporting the adhesive layer under compression, thereby improving the heat dissipation characteristics of semiconductor packages.
Implementation Method 1
an alumina filler and a diamond filler dispersed in an adhesive layer... significantly improves thermal conductivity... improving the heat dissipation characteristics
Data Source
AI summary
A die attach film including an adhesive layer, an alumina filler disposed in the adhesive layer, and a diamond filler disposed in the adhesive layer, wherein a content of the alumina filler and the diamond filler in combination is about 70 parts by weight to about 85 parts by weight based on 100 parts by weight of the adhesive layer, and a ratio of parts by weight of the alumina filler to parts by weight of the diamond filler is about 2:1 to about 3:1.