Conductive Adhesive Layer for Through-Thickness Heat Dissipation
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Solution Overview
Problem
Existing electromagnetic wave shielding heat dissipation sheets do not provide sufficient heat dissipation properties, particularly in the thickness direction, for 5G electronic devices.
Innovation Solution
An electrically conductive adhesive layer composed of a binder component and conductive particles, including first and second particles with different diameters, where the second particles are flaky and covered with a metal layer, is designed to enhance thermal conductivity and electromagnetic wave shielding by optimizing particle orientation and contact under pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional electromagnetic wave shielding heat dissipation sheets are used, then electromagnetic wave shielding properties are maintained, but heat dissipation properties in the thickness direction are insufficient
Solution Approach 1:
The patent uses a composite particle system consisting of flaky conductive particles (with aspect ratio 2.0 or more) and spherical conductive particles in specific volume ratios (50-90 vol% flaky, 10-50 vol% spherical). This composite structure creates multiple thermal conduction pathways while maintaining electromagnetic shielding, resolving the contradiction between heat dissipation performance and shielding effectiveness.
Solution Approach 2:
The patent optimizes the volume ratio parameters of different particle shapes and sizes to achieve maximum thermal conductivity. By controlling the flaky particle content at 50-90 vol% and spherical particles at 10-50 vol%, the thermal conduction network is optimized for thickness direction heat dissipation while maintaining adequate electromagnetic shielding properties.
2Temperature
If flaky particles are used to improve thermal conductivity, then particle orientation under pressure enhances heat dissipation, but manufacturing complexity increases
Solution Approach 1:
The patent exploits the dynamic response of flaky particles to applied pressure. During lamination, pressure causes the flaky particles to orient themselves perpendicular to the pressure direction, automatically creating the desired orientation for thickness-direction thermal conduction without requiring complex alignment equipment or processes.
Solution Approach 2:
The flaky particles self-orient during the lamination process through their inherent geometric properties and response to compression. The particles automatically arrange themselves in orientations that maximize thermal conduction in the thickness direction, eliminating the need for external orientation control mechanisms.
3Temperature
If high concentration of conductive particles is used to improve electrical conductivity and electromagnetic shielding, then thermal conductivity improves, but viscosity of the adhesive composition increases
Solution Approach 1:
The patent divides the conductive particle population into two segments: flaky particles (providing thermal conduction pathways) and spherical particles (providing flowability and filling voids). This segmentation allows the system to achieve high thermal conductivity through the flaky particle network while the spherical particles maintain low viscosity and good processability.
Solution Approach 2:
The spherical conductive particles act as intermediary elements that fill the spaces between flaky particles, improving the overall packing density and thermal conduction network while maintaining low viscosity. The spherical particles mediate between the high thermal conductivity requirement and the low viscosity requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive layer achieves high thermal conductivity in both the thickness and perpendicular directions while maintaining electromagnetic wave shielding properties, with thermal conductivity ranging from 4 to 20 W/m·K in the thickness direction and 4 to 100 W/m·K in the perpendicular direction.
Implementation Method 1
Thermal conduction of the electrically conductive adhesive layer mostly depends on the contact between the electrically conductive particles
Implementation Method 2
since the second particles are flaky, when pressure is applied to the thickness direction of the electrically conductive adhesive layer, the second particles are easily oriented in a direction perpendicular to the thickness direction
Implementation Method 3
Use of a metal having a high electrical conductivity and a high thermal conductivity as the metal layer enables improvement in the electrical conductivity and thermal conductivity
Implementation Method 4
Use of a metal having a high electrical conductivity and a high thermal conductivity as the metal layer enables improvement in the electrical conductivity and thermal conductivity
Data Source
AI summary
The present invention provides an electrically conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining its electromagnetic wave shielding properties. The electrically conductive adhesive layer of the present invention includes a binder component and electrically conductive particles, wherein the electrically conductive particles include first particles and second particles having a smaller median diameter than the first particles, the second particles are flaky particles each including a core particle covered with a metal layer, and a percentage of a mass of the electrically conductive particles relative to a mass of the electrically conductive adhesive layer is 60 to 90 mass %.