Bio-based Polyurethane Polishing Pad for CMP
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Solution Overview
Problem
The existing polishing pads for semiconductor devices in CMP processes lack environmental friendliness and do not achieve the required polishing rate, necessitating the development of a more sustainable and effective polishing pad.
Innovation Solution
A polishing pad with a polishing layer composed of a polyurethane resin, where the polyurethane resin includes a bio-based polymer polyol and a bio-based monomer polyol, is developed. This pad is prepared through a process involving the preparation of a urethane prepolymer and its curing to form the polishing layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If petroleum-based raw materials are used to manufacture polishing pads, then the polishing rate and physical properties can be optimized, but environmental friendliness deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the polishing pad by substituting petroleum-based polyols with bio-based polymer polyols derived from renewable resources. This parameter change maintains the necessary physical properties (hardness, tensile strength, elongation) while improving environmental friendliness by using sustainable raw materials.
Solution Approach 2:
The patent creates a composite material system combining bio-based polymer polyol with polyisocyanate to form a polyurethane resin. This composite approach allows the integration of renewable materials while maintaining the mechanical properties required for effective CMP polishing operations.
2Object-affected harmful factors
If biomass raw materials are used to increase environmental friendliness, then environmental friendliness is improved, but the polishing rate may deteriorate
Solution Approach 1:
The patent optimizes the molecular weight, hydroxyl value, and composition ratios of the bio-based polymer polyol to ensure that the resulting polishing pad achieves the required polishing rate. By carefully adjusting these parameters, the patent maintains effective polishing performance while using sustainable bio-based materials.
Solution Approach 2:
The patent applies local quality by optimizing specific regions or aspects of the polyol composition (such as the ratio of polymer polyol to monomer polyol) to ensure that the polishing surface has the necessary properties for high polishing rate, while other aspects maintain environmental friendliness.
3Object-affected harmful factors
If the composition of bio-based polyols is optimized for environmental friendliness, then environmental friendliness is improved, but physical properties such as hardness and tensile strength may deteriorate
Solution Approach 1:
The patent creates a composite polyol system combining bio-based polymer polyol with bio-based monomer polyol in specific ratios. This composite approach allows the material to achieve both environmental friendliness and the necessary physical strength properties for polishing pad application.
Solution Approach 2:
The patent adjusts the molecular weight, hydroxyl value, and compositional ratios of the bio-based polyol components to simultaneously achieve environmental friendliness and adequate tensile strength. By optimizing these parameters, the patent ensures that the polishing pad maintains structural integrity while using sustainable materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bio-based polishing pad exhibits excellent environmental friendliness while maintaining the necessary physical properties for effective CMP processes, including hardness, tensile strength, and elongation, thereby achieving a high polishing rate and pad cut rate.
Implementation Method 1
the polishing layer comprises a polyurethane resin, the polyurethane resin comprises a polyol and a polyisocyanate
Implementation Method 2
curing the urethane prepolymer to prepare a polishing layer comprising a polyurethane resin
Data Source
Figure 1~3
Figure 4
AI summary
The present invention relates to an environmentally friendly polishing pad and to a process for preparing the same. The polishing pad prepared from a polyurethane resin comprising a bio-based polymer polyol has excellent environmental friendliness and has physical properties such as hardness and modulus required for a CMP process. Thus, it can be used in the manufacture of semiconductor substrates to demonstrate excellent performance.