Grinding Devices TRIZ Cases

Water jet cutting creates a lightweight pad dresser gear that preserves flatness, eases handling, and supports precise polishing.

By shifting the tool axis behind the spider arm, this adapter prevents uneven pivoting, supports free rotation, and extends tool life.

By shifting the tool axis behind the spider arm, this adapter prevents pivot binding and uneven wear on concrete finishing tools.

Uniform columnar holes in a CMP pad hold polishing slurry more steadily, reducing polishing variation and improving workpiece uniformity.

A CMP polishing pad uses a hard foundation layer bonded to a soft urethane surface layer for independent property control.

Mold cavity solidification creates the detection window, preventing liquid penetration and improving bonding strength.

Lateral adhesive sealant filling prevents delamination and leakage risks while maintaining endpoint detection accuracy.

Thermoset polyurethane polishing pad with closed cell pores achieves low density.

A bio-based polyurethane polishing pad uses renewable polyols to form a durable layer.

Cell assemblies with internal anvils intensify pressure within the cell medium to accelerate superhard material synthesis.

Automated dispensing apparatus cuts fluid streams and releases plates to eliminate sling defects and raw material waste during polishing pad production.

A polishing pad with microspheres uses optimized open pore distribution to maintain high material removal rates.

A two-step abrasive mixture deposition and leveling process ensures consistent density in ultrathin grinding wheel molds.

Eliminates costly braze alloys by shrinking a tungsten carbide green body around the superabrasive compact during sintering.

Diamondene fragments distribute catalyst uniformly during HPHT processing, resolving gaps and incomplete bonding in polycrystalline diamond cutters.

Axial mixing device intermixes liquid components to form a groove-patterned polishing layer, eliminating machining steps and improving pattern quality.

Chemical vapor deposition creates a dense silicon carbide coating on graphite to prevent wear and chemical degradation during grinding.

Segmented tapered trenches in the polishing pad retain slurry and remove debris to prevent wafer scratches.

Replacing petroleum materials with 10 to 50 percent biomass polyol resolves the contradiction between environmental friendliness and polishing rate stability.