Biomass Polishing Pad for CMP Environmental Trade-offs
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Solution Overview
Problem
The chemical mechanical planarization (CMP) process in semiconductor manufacturing requires polishing pads with stable physical properties to achieve high polishing rates, but existing pads are often made from petroleum-based materials, which are not environmentally friendly and need to be replaced with biomass-based alternatives that maintain performance.
Innovation Solution
A polishing pad comprising a top pad layer made from a biomass-containing composition, specifically a biomass-containing urethane prepolymer, with a biomass content of 1 to 50% by weight, optimized to achieve the required physical properties for CMP processes while being environmentally friendly, prepared through a process involving a urethane prepolymer composition, curing agent, and foaming agent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If petroleum-based raw materials are used to manufacture polishing pads, then the polishing pad achieves stable physical properties and required polishing rate, but the environmental friendliness deteriorates
Solution Approach 1:
The patent changes the material composition parameter by replacing petroleum-based raw materials with biomass-based raw materials (specifically polyol with 10-50% biomass content). This parameter change maintains the polishing pad's physical properties and polishing rate while improving environmental friendliness and biodegradability.
Solution Approach 2:
The patent uses composite materials by combining biomass-based polyol with petroleum-based polyol in specific ratios (10-50% biomass content). This composite approach allows the polishing pad to maintain the stable physical properties required for CMP processes while incorporating environmentally friendly biomass components.
2Object-affected harmful factors
If biomass raw materials are used to manufacture polishing pads, then the environmental friendliness is improved, but the physical properties and polishing rate may deteriorate
Solution Approach 1:
The patent optimizes the biomass content parameter to 10-50% by weight in the polyol composition. This specific parameter range ensures that the polishing pad maintains adequate physical properties and polishing rate while achieving improved environmental friendliness compared to 100% petroleum-based materials.
Solution Approach 2:
The patent employs composite materials by formulating a mixed polyol system containing both biomass-based polyol and petroleum-based polyol. This composite structure allows the polishing pad to benefit from the environmental advantages of biomass materials while the petroleum-based component ensures sufficient mechanical strength and polishing performance.
3Object-affected harmful factors
If 100% biomass content is used in the polishing pad, then the environmental friendliness is maximized, but the physical properties such as hardness and modulus may become insufficient for CMP processes
Solution Approach 1:
The patent sets the biomass content parameter within the 10-50% range rather than using 100% biomass. This parameter optimization ensures that the polishing pad maintains adequate hardness and modulus for CMP processes while still achieving significant environmental benefits compared to conventional petroleum-based materials.
Solution Approach 2:
The patent uses composite materials by combining biomass-based polyol with petroleum-based polyol in a 10-50% ratio. The petroleum-based component compensates for any deficiency in mechanical strength, ensuring the polishing pad achieves sufficient hardness and modulus for industrial CMP applications while incorporating environmentally friendly biomass materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polishing pad achieves excellent surface processing quality and high polishing rates for semiconductor substrates while being environmentally friendly, with optimized biomass content ensuring the necessary hardness, modulus, and durability for CMP processes.
Implementation Method 1
preparing a biomass-containing urethane prepolymer from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material
Implementation Method 2
preparing a biomass-containing composition comprising the biomass-containing urethane prepolymer, a curing agent, and a foaming agent
Implementation Method 3
curing the biomass-containing composition to prepare a top pad layer
Data Source
AI summary
The embodiment relates to a polishing pad for use in a chemical mechanical planarization process of semiconductor devices. The polishing pad comprises a top pad layer, wherein the polishing pad has a total biomass content of 1 to 50% by weight as measured according to the ASTM D 6866 standard; thus, it can be environmentally friendly.