CMP Pad Columnar Hole Structure for Stable Slurry Accommodation

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Solution Overview

Problem

Existing chemical mechanical polishing (CMP) pads face challenges in consistently accommodating polishing slurry, leading to variations in polishing performance across different workpieces.

Innovation Solution

The introduction of columnar holes on the polishing surface of CMP pads, with uniform dimensions and distribution, allows for stable slurry accommodation, enhancing polishing stability and uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional CMP pad structure is used, then manufacturing is simpler, but slurry accommodation stability is poor leading to performance variations

Engineering Contradiction:

Improveslurry accommodation stabilityVSAvoidpad structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The pad surface is segmented into multiple columnar holes distributed across the polishing surface. Each columnar hole acts as an independent slurry accommodation unit, ensuring stable slurry supply to different regions of the workpiece. This segmentation resolves the contradiction by creating a structured yet manageable configuration that improves slurry accommodation stability without excessive complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pad incorporates a porous structure through the columnar holes that penetrate through the pad thickness. This porous configuration enables the pad to accommodate and retain polishing slurry within the columnar hole structures, providing stable slurry supply during polishing operations. The porous design directly addresses the slurry accommodation stability issue while maintaining reasonable manufacturing complexity.

Inventive Principle:

Principle #31Porous materials

2Manufacturing precision

If columnar holes are added to improve slurry accommodation, then polishing uniformity improves, but manufacturing complexity increases

Engineering Contradiction:

Improvepolishing uniformityVSAvoidpad manufacturing ease

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The columnar holes are formed in the pad during the manufacturing process before the pad is put into service. This preliminary formation of the hole structure ensures that the slurry accommodation capability is built-in from the start, leading to consistent polishing uniformity from the first use. The pre-formed structure avoids the need for complex post-manufacturing adjustments while achieving the desired polishing precision.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The pad design specifies particular parameters for the columnar holes including their diameter, depth, and distribution pattern across the pad surface. By optimizing these parameters during the design phase, the pad achieves improved polishing uniformity. The parameter optimization balances the need for effective slurry accommodation with manufacturability constraints, resolving the contradiction between precision and ease of manufacture.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20260070184A1Chemical mechanical polishing (CMP) pad and manufacturing method thereof

Publication Date: 2026.03.12 NAN YA TECH

AI summary

A chemical mechanical polishing (CMP) pad includes a pad body. The pad body has a polishing surface and a plurality of inner surfaces respectively connected with the polishing surface. The inner surfaces are separated from each other and respectively surround to define a columnar hole. The polishing surface is configured to polish against a workpiece. The columnar holes are configured to accommodate a polishing slurry.