CMP Polishing Layer Groove Formation via Axial Mixing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for forming chemical mechanical polishing pad polishing layers require multiple process steps and machining of the groove pattern, limiting efficiency and quality.
Innovation Solution
A method using an axial mixing device with specific liquid and gas feed ports to intermix a poly side liquid component and an iso side liquid component, which are then discharged and solidified to form a polishing layer with a groove pattern, eliminating the need for machining and enhancing the groove pattern quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional methods are used to form polishing layers, then the groove pattern can be achieved through machining, but the number of process steps increases and manufacturing efficiency decreases
Solution Approach 1:
The groove pattern is pre-formed in the mold base before the polishing layer material is introduced. When the material cures in the mold, the groove pattern is automatically transferred to the polishing layer surface, eliminating the need for subsequent machining operations. This preliminary action integrates multiple steps into one simultaneous process.
Solution Approach 2:
The invention combines the molding process with the groove pattern formation process into a single integrated operation. The mold base with the negative groove pattern serves both as the forming tool and the pattern source, merging what were previously separate machining and molding steps into one unified manufacturing process.
2Manufacturing precision
If conventional machining methods are used to create groove patterns, then the pattern can be formed, but the quality and precision of the groove pattern is limited
Solution Approach 1:
The negative groove pattern in the mold base serves as a master copy or template. This pattern is directly copied onto the polishing layer through the molding process, ensuring high precision and consistency. The copying mechanism transfers the exact groove geometry without the limitations of subsequent machining operations.
Solution Approach 2:
The groove pattern is pre-defined in the mold base with high precision before production. This preliminary creation of the pattern master allows for superior groove pattern quality in the final product, as the pattern is established once with high accuracy rather than being created repeatedly through machining.
3Ease of manufacture
If multiple process steps are used to manufacture polishing layers, then each step can be optimized independently, but the total manufacturing time and cost increase
Solution Approach 1:
The invention merges the groove pattern creation and polishing layer formation into a single simultaneous process. The mold base with the negative groove pattern and the curing material work together in one operation, eliminating the sequential steps of machining grooves after layer formation, thereby reducing total manufacturing time.
Solution Approach 2:
The groove pattern is pre-prepared in the mold base before the polishing layer is manufactured. This preliminary action allows the pattern to be ready for immediate transfer during the molding process, eliminating the need for separate pattern creation steps and reducing overall manufacturing time while maintaining process flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the number of process steps, improves the quality of the groove pattern, and broadens the compositional window for polishing layer manufacturing, resulting in a more efficient and effective polishing pad.
Implementation Method 1
the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas are intermixed within the internal cylindrical chamber to form a combination
Implementation Method 2
the pressurized gas is introduced into the internal cylindrical chamber through the at least one tangential pressurized gas feed port with a supply pressure of 150 to 1,500 kPa; wherein an inlet velocity into the internal cylindrical chamber of the pressurized gas is 90 to 600 m/s
Implementation Method 3
discharging the combination from the open end of the internal cylindrical chamber toward the base at a velocity of 10 to 300 m/sec; allowing the combination to solidify into a cake
Data Source
AI summary
A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.