Biomass Photosensitive Material for PCB Anti-Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing of printed circuit boards generates significant non-biodegradable waste due to the use of petrochemical raw materials in anti-soldering treatments, necessitating a transition to more environmentally friendly biomass alternatives.
Innovation Solution
A biomass photosensitive material is developed through a ring-opening addition reaction between a copolymer of itaconic anhydride and acrylate, combined with a monomer containing a single hydroxy group and a carbon-carbon double bond, which forms an anti-soldering layer suitable for printed circuit boards, replacing traditional petrochemical-based materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If petrochemical raw materials are used for anti-soldering treatment, then the anti-soldering layer can be formed effectively, but non-biodegradable waste is generated and environmental friendliness deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the anti-soldering layer from petrochemical-based materials to biomass-based materials. Specifically, it uses a photosensitive biomass material containing a copolymer of itaconic anhydride and acrylate, along with a monomer having a hydroxy group and carbon-carbon double bond, which undergoes ring-opening addition reaction. This parameter change maintains the functional performance of the anti-soldering layer while eliminating non-biodegradable waste generation.
Solution Approach 2:
The patent creates a composite photosensitive biomass material by combining a copolymer (from itaconic anhydride and acrylate polymerization) with a specific monomer containing hydroxy group and carbon-carbon double bond. This composite material structure enables the formation of effective anti-soldering layers while being biodegradable, thus resolving the contradiction between functional reliability and environmental friendliness.
2Object-generated harmful factors
If biomass materials are used to replace petrochemical materials, then environmental friendliness is improved, but the material must undergo specific chemical reactions to maintain performance
Solution Approach 1:
The patent employs a self-service approach by designing a photosensitive biomass material that automatically undergoes the necessary chemical transformations when exposed to light during the standard photoresist processing workflow. The copolymer and monomer components naturally undergo ring-opening addition reaction upon photo-exposure, eliminating the need for separate or complex chemical processing steps. This maintains environmental friendliness while avoiding increased process complexity.
3Ease of manufacture
If traditional photoresist materials are used, then the manufacturing process is simple, but the anti-soldering layer lacks improved thermal resistance
Solution Approach 1:
The patent changes the thermal parameters of the anti-soldering layer by using a biomass-based photosensitive material with specific molecular structure (copolymer of itaconic anhydride and acrylate combined with hydroxy-containing monomer). This material provides improved thermal resistance while maintaining compatibility with standard photoresist manufacturing processes, thus resolving the contradiction between process simplicity and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The biomass photosensitive material effectively forms a protective anti-soldering layer with improved thermal resistance and environmental sustainability, reducing waste generation and enhancing the eco-friendliness of the printed circuit board manufacturing process.
Implementation Method 1
a product of a ring-opening addition reaction from a copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond, wherein the copolymer is polymerized of (a) itaconic anhydride and (b) acrylate, and the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group are reacted in the ring-opening addition reaction
Implementation Method 2
the photoresist material includes the biomass photosensitive material and a photo initiator
Data Source
AI summary
A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and (2) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.