Printed Circuit Aspects TRIZ Cases

A press-fit terminal deformation part with a recess and boundary portions increases contact area.

Multi-layer covering members with nested openings accommodate excess solder, preventing short-circuits between densely packed surface electrodes.

An embedded bridge interconnect assembly routes signals between dies using vertical vias through a glass or semiconductor substrate.

Dummy lanes in a printed circuit board bypass defective wirings through lane shifting, maintaining normal function despite manufacturing defects.

Segmented contact groups with voids optimize trace routing, reducing circuit board thickness and manufacturing costs.

A wiring board via mix area places metal between fillers on the inner radial side, preventing voids in high aspect ratio holes.

A circuit board structure uses pins to connect with gold fingers on a second board.

Semicured insulating material bonds adjacent substrates via direct surface contact and connection vias.

Nested grounding contacts and inclined rear cables provide electromagnetic shielding between densely arranged cable assembly modules.

Dielectric-filled vias eliminate plugging steps while providing thermal dissipation through a metal core layer.

Opposite-side sensor and readout integration reduces temperature gradients and crosstalk in laser radar receivers.

Electrophoretic deposition creates a uniform dielectric layer in the plated through hole, eliminating drilling errors and reducing crosstalk.

A magnetic module mounts four isolated transformers on a single PCB face to minimize footprint.

Dynamic vias change radius when connected to traces, reducing unused space and minimizing the number of layers required for multi-layer circuit substrates.

Modified polyphenylene ether resin suppresses dielectric constant increases from water absorption to sustain signal transmission speed in humid environments.

A circuit board uses multiple trace layers to electrically couple different electronic components without redesigning the substrate.

An adapter component with insulated pads connects display panels to flexible circuit boards, preventing wiring breakage during large-angle bending.

A display panel integrates alignment marks in a low pixel density area to match camera module positioning for precise assembly.

A voltage regulator module housing integrates a coolant flow path to manage thermal loads from high-power components.

Trapezoidal panel and package bonding pins shift longitudinally to maintain contact during chip-on-film assembly.

Laminated resin layers reinforce suspension wiring circuit board connection portions, suppressing damage from load stress and stabilizing deformation control.

A graphene layer mediates adhesion between insulating material and build-up circuit structures, resolving heterogeneous bonding issues that cause signal loss.

Exposed conductive vias on a cut panel edge enable direct perpendicular mounting to another circuit board.

A display panel uses a substrate hole to bridge conductive and circuit layers on opposite surfaces, reducing the visible border width.

Stacking copper foil with openings over cores and bonding sheets enables lamination without wrinkles, exposing the conductive layer for pattern formation.

A high density package substrate uses a bottom pad on the lower copper foil to prevent laser drill punch through during fabrication.

Metal mesh patterns replace indium tin oxide electrodes in transparent displays, balancing wire visibility with conductivity and aperture ratio.

A multilayer substrate incorporates a rigid supplementary member positioned within the stack to support overlapping electronic components.

An infrared sensor uses a thermal resistance adjusting film to balance heat input, preventing short-circuits from asymmetric lead wire connections.

Passive NTC thermistors monitor PCB temperatures to trigger shutdown signals before hotspots cause catastrophic damage.

Flexible circuit board pads overlap display panel pads to prevent misalignment and short circuits during the bonding process.

Replacing epoxy with aromatic tetrafunctional vinylbenzyl resin lowers dissipation factor to under 0.0060 while maintaining thermal resistance above 195°C.

Selective damping on longer signal paths reduces reflections and power consumption while improving signal quality in multi-memory electronic apparatuses.

A flexible comb-shaped wiring board electrically connects light emitting modules through conductive teeth.

Direct type backlight device positions light reflector below Mini-LED bottom surfaces to resolve luminous efficiency loss from reflector interference.

A double-sided printed circuit board manufacturing method forms conductive patterns on both insulation layer sides before creating connecting through holes.

Adjusts wiring cross-sectional areas to equalize resistance, preventing voltage variations from differing path lengths in compact optical modules.

Antipad geometry modification alters differential via impedance, reducing signal loss and power consumption at higher frequencies.

Low void ratio in the thermosetting resin prevents electric field concentration at end surfaces, maintaining withstand voltage for thick circuit layers.

A biomass photosensitive material forms a protective anti-soldering layer through ring-opening addition reactions between itaconic anhydride copolymers and hydroxy monomers.

Incorporating phosphorus into a DCPD-derived polyether creates a non-flammable curing agent that maintains low dielectric constants below 2.7.

Segmented base layer with light transmission openings connects circuit boards to display panels via conductive adhesive, resolving bending disconnection risks.

Merging parylene vapor deposition with a thermally reworkable underfill reduces assembly complexity while preserving component integrity during repair cycles.

EEPROM records pass or fail flags on each board to prevent faulty units from entering fire pump control systems.

Final forming bends contacts past 90 degrees to prevent backing out, ensuring uniform solder ball placement and reducing warpage.

Selective plating on the upper pad surface prevents nickel expansion from reducing line width, securing fine pitch reliability in embedded trace substrates.

A flexible heating device uses double-sided polymer circuitry to distribute heat evenly across the substrate surface.

An insulating cold plate manifold with integrated cavities reduces thermal resistance by eliminating separate insulation layers.

A circuit board uses a trench portion and protective layer to expose connection pads while shielding solder ball areas from underfill material migration.

Laser ablation creates precise cavities in the paint layer, eliminating screen printing haziness and reducing uncovered regions near conductor vias.