Double Sided PCB Manufacturing via Sequential Circuit Formation

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Solution Overview

Problem

The existing methods for manufacturing double-sided printed circuit boards are complex and inefficient, making it difficult to form circuit patterns on both sides of an insulation layer and establish electrical connections between them, leading to decreased productivity and increased failure rates.

Innovation Solution

A manufacturing method that involves forming conductive circuit patterns on both sides of an insulation layer, creating a through hole, and depositing conductive material on the inner surface of the hole to connect the patterns, with optional protective film lamination and heat treatment to simplify the process and enhance connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If blanket etching and pre-coating processes are performed to form circuit patterns on both sides of an insulation layer, then circuit patterns can be formed on upper and lower sides, but the manufacturing process becomes too complicated and productivity decreases

Engineering Contradiction:

Improveease of forming circuit patternsVSAvoidproductivity

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent divides the manufacturing process into separate sequential steps: first forming the upper circuit pattern, then forming the lower circuit pattern, and finally forming through-holes for electrical connection. This segmentation eliminates the need for complex blanket etching and pre-coating processes that were required in conventional methods to simultaneously handle both sides, thereby simplifying the overall manufacturing process while maintaining productivity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent inverts the conventional sequence by forming circuit patterns on both sides before creating through-holes, rather than preparing the substrate with through-holes first. This reversal eliminates the need for pre-coating and shadow processes, significantly simplifying the manufacturing process and improving productivity

Inventive Principle:

Principle #13The other way round (Inversion)

2Strength

If through holes are plated to increase thickness for mechanical strength, then the FCCL becomes too thick for precision micro-pattern etching, but etching precision is required for micro-patterns

Engineering Contradiction:

Improvemechanical strength of FCCLVSAvoidprecision of micro-pattern etching

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent performs the circuit pattern formation on both sides before creating through-holes and performing any plating operations. This preliminary action ensures that the FCCL thickness remains appropriate for precision micro-pattern etching, while mechanical strength is subsequently provided by the plated through-holes and overall board structure

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent separates the functions of achieving mechanical strength and creating precision patterns into different sequential steps: precision micro-pattern etching is performed on the un-plated FCCL, and mechanical strength is subsequently provided through controlled through-hole plating, eliminating the contradiction between thickness requirements

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If multiple processes including exposure, development, etching and delamination are performed to form circuit patterns, then circuit patterns can be formed, but the process becomes too complicated leading to increased failure rate

Engineering Contradiction:

Improveease of forming circuit patternsVSAvoidfailure rate

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts and eliminates the complex multi-step processes of exposure, development, etching and delamination from the manufacturing sequence. Instead, circuit patterns are formed through direct printing or deposition methods on both sides of the insulation layer, significantly reducing the number of process steps and minimizing opportunities for failures while maintaining ease of manufacture

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the process, reduces manufacturing time, increases productivity, and enhances product quality by allowing for easier adjustment of pattern thickness and elimination of complex steps like exposure and etching, while reducing environmental pollutants.

Implementation Method 1

forming a conductive material on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10080299B2Manufacturing method of double sided printed circuit board

Publication Date: 2018.09.18 INKTEC CO LTD

AI summary

Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.