Laser Radar Receiver PCB with Opposite-Side Sensor and Readout Integration
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Solution Overview
Problem
Conventional laser radar systems face challenges in achieving high imaging frame rates, long-distance ranging, small volume, high reliability, and low cost due to issues with discrete component construction, such as large PCB boards, electrical separation, and temperature gradient inconsistencies affecting avalanche photodiode gain, which lead to crosstalk and inconsistency in detecting long ranges.
Innovation Solution
A receiving device with a printed circuit board (PCB) substrate hosting a photoelectric sensor array and a readout chip on opposite sides, featuring packaged trans-impedance amplification circuits and an N-to-1 switch for signal processing, along with a heat sink for temperature management, reduces wiring length and improves heat dissipation, enhancing gain and bandwidth consistency across channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete components are used to construct the detecting and receiving system, then the system can be assembled with standard components, but the PCB board area becomes large and wiring complexity increases
Solution Approach 1:
The patent integrates multiple discrete components (photoelectric sensors, trans-impedance amplifiers, and readout circuits) into a single integrated circuit board. The photoelectric sensor array is directly mounted on the PCB substrate with corresponding readout circuits, eliminating the need for separate connector boards and reducing overall PCB area while maintaining assembly ease through standardized mounting processes.
Solution Approach 2:
The patent arranges photoelectric sensors and their corresponding readout circuits in a spatially optimized layout on the PCB substrate, with sensors on one side and readout circuits on the other side. This dimensional arrangement reduces wiring length and board area compared to traditional planar discrete component layouts.
2Quantity of substance
If multiple PCB boards are connected through connectors to increase wiring area, then more components can be accommodated, but electrical separation among pins is low and crosstalk problems occur
Solution Approach 1:
The patent consolidates multiple PCB boards into a single integrated PCB substrate, eliminating the need for inter-board connectors. All photoelectric sensors and readout circuits are mounted on the same substrate, ensuring high electrical separation and preventing crosstalk between channels while accommodating the required component quantity.
Solution Approach 2:
The patent segments the PCB substrate into distinct regions for photoelectric sensors and readout circuits, with dedicated wiring paths between them. This segmentation ensures electrical isolation between adjacent channels while maintaining short wiring lengths, preventing crosstalk and signal integrity issues.
3Measurement precision
If 64 avalanche photodiodes are distributed on scattered positions on the receiving plate, then the photoelectric detection coverage is improved, but temperature gradient increases and gain consistency deteriorates
Solution Approach 1:
The patent implements localized thermal management by positioning heat dissipation structures near each photoelectric sensor group on the PCB substrate. This allows different regions of the board to maintain appropriate temperatures independently, reducing temperature gradients across the distributed sensor array while preserving detection coverage.
Solution Approach 2:
The patent introduces thermal coupling structures and heat spreaders that equalize temperature distribution across the PCB substrate. These structures create thermal equipotential regions, ensuring that all photoelectric sensors operate at similar temperatures despite being distributed across different positions, thereby maintaining gain consistency.
4Ease of operation
If wiring length between photoelectric sensors and readout circuits is increased, then routing flexibility is improved, but parasitic parameters increase and response characteristics become inconsistent
Solution Approach 1:
The patent utilizes the third dimension (vertical spacing) by mounting photoelectric sensors and readout circuits on opposite sides of the PCB substrate. Connection wires pass through the substrate thickness, significantly reducing wiring length compared to surface-mounted routing while maintaining routing flexibility through via holes and internal trace layers.
Solution Approach 2:
The patent divides the PCB substrate into modular sections, each containing a photoelectric sensor and its corresponding readout circuit in close proximity. This segmentation minimizes wiring length within each module while allowing flexible inter-module routing, maintaining both response consistency and routing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high distance ranging consistency, reduces temperature gradients, simplifies assembly, and minimizes crosstalk, resulting in improved performance and reliability of the laser radar system while optimizing space and cost.
Implementation Method 1
a proper heat dissipation or heat distribution structure can effectively reduce such a gradient
Implementation Method 2
a proper heat dissipation or heat distribution structure can effectively reduce such a gradient
Implementation Method 3
a photoelectric sensor array, including a plurality of photoelectric sensors, where the photoelectric sensor array is disposed on the first side of the PCB substrate
Implementation Method 4
The readout chip includes N packaged trans-impedance amplification circuits and an N-to-1 switch, where an input terminal of each trans-impedance amplification circuit is coupled to one of the photoelectric sensors
Data Source
AI summary
A receiver for a laser radar, including: a printed circuit board (PCB) substrate, where the PCB substrate includes a first side and a second side; a photoelectric sensor array, including a plurality of photoelectric sensors, where the photoelectric sensor array is disposed on the first side of the PCB substrate; and a readout chip, where the readout chip is disposed on the second side of the PCB substrate, coupled to the photoelectric sensor array, and configured to receive and read an output of a photoelectric sensor in the photoelectric sensor array.