VRM Cooling Structure with Nested Capacitor Arrays
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Solution Overview
Problem
Voltage Regulator Modules (VRMs) face challenges in compact design due to high capacitance requirements and heat management, as they need to supply low DC voltage with high current while maintaining a small footprint and preventing component degradation.
Innovation Solution
The design incorporates multiple circuit boards oriented in parallel and perpendicular planes to accommodate capacitors and inductors, along with a cooling system that uses coolant flow to manage heat, ensuring efficient power delivery and component longevity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If prior capacitor arrays are used to provide substantial capacitance, then the capacitance requirement is met, but the footprint size increases and becomes too large for compact VRM design
Solution Approach 1:
The patent implements a nested capacitor array where capacitor units are arranged in multiple stacked layers within a compact footprint. Capacitors are positioned in vertical stacks (e.g., four capacitors stacked vertically) and multiple such stacks are arranged horizontally, creating a three-dimensional nested structure that maximizes capacitance density while minimizing the overall footprint area.
Solution Approach 2:
The patent transitions from a two-dimensional capacitor arrangement to a three-dimensional stacked configuration. By utilizing vertical stacking of capacitor units across multiple layers (e.g., first and second stacked arrays of capacitors), the design achieves substantial total capacitance within a small planar footprint, effectively adding the vertical dimension to the capacitor layout.
2Power
If VRM components are operated at high power to meet IC requirements, then power delivery capability is improved, but heat generation increases and requires substantial cooling
Solution Approach 1:
The patent converts the harmful heat generated by high-power VRM operation into a manageable thermal flow pattern. The meandering coolant flow path is specifically designed to follow the heat generation zones, transforming the waste heat into a controlled thermal management challenge that can be systematically addressed through optimized coolant routing that maximizes heat extraction efficiency.
Solution Approach 2:
The patent introduces coolant as an intermediary substance to transfer heat away from the VRM components. The coolant flows through channels positioned adjacent to heat-generating elements (capacitors, inductors, VRM circuit board), acting as a thermal mediator that absorbs excess heat and transports it to external cooling systems, thereby protecting components from thermal damage.
3Power
If VRM components are operated at high current to supply low voltage power, then power delivery to ICs is improved, but component degradation accelerates and reliability decreases
Solution Approach 1:
The patent implements preliminary cooling action by positioning coolant flow channels and heat dissipation structures before components reach critical temperature levels. The cooling system is designed to actively remove heat as it is generated during high-current operation, preventing thermal accumulation that would lead to component degradation and failure, thereby extending component lifespan and maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for compact, high-power VRMs that effectively condition output voltage and manage heat, ensuring reliable operation and extended lifespan of components.
Implementation Method 1
a cooling structure including a housing, a VRM circuit board, an upper PCB, a lower panel, and a coolant inlet/outlet adapter
Implementation Method 2
coolant flow to manage heat
Data Source
AI summary
A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in a parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapted and the coolant outlet adapter may provide support for the VRM.