Flexible Circuit Board Pad Overlap for Display Panel Bonding Misalignment

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Solution Overview

Problem

Display devices face misalignment and short circuits during the bonding process of pads due to pressure and residue from the cutting process of the display substrate, leading to defective operations and reduced reliability.

Innovation Solution

A display device design featuring a flexible circuit board with pads that overlap the display panel pads and signal lines, reducing misalignment and short circuits by optimizing the bonding process and using a conductive film for connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If pressure is applied during the bonding process of pads, then bonding strength is improved, but misalignment between pads occurs

Engineering Contradiction:
Improvebonding strengthVSAvoidpad alignment precision
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-aligning the pads before bonding and using a fixation structure to maintain alignment during the bonding process. The pads are positioned and fixed in advance, preventing misalignment even when pressure is applied during bonding.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the cutting device applies heat and pressure to cut the display substrate, then cutting efficiency is improved, but residue is generated that causes short circuits

Engineering Contradiction:
Improvecutting efficiencyVSAvoidresidue causing short circuit
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts and removes the residue from the cutting surface using a cleaning device. The cleaning device specifically targets and removes the harmful residue generated during cutting, preventing it from causing short circuits while allowing efficient cutting to continue.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the harmful residue into a removable byproduct by designing a cleaning mechanism that specifically targets the residue. The residue generation is accepted as necessary for efficient cutting, but its harmful effect is neutralized by the cleaning device that removes it before it can cause short circuits.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Quantity of substance

If pads are disposed in multiple rows to meet high resolution demand, then signal line capacity is improved, but misalignment and short circuit risk increase

Engineering Contradiction:
Improvenumber of signal linesVSAvoidbonding reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent segments the pads into multiple rows with clear spatial separation. Each pad in the multiple-row configuration is given a distinct position with sufficient spacing, allowing individual alignment and bonding. The segmentation reduces the complexity of aligning multiple pads by treating them as separate, manageable units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary fixation structure that mediates between the multiple pads during bonding. This intermediary structure holds all pads in their correct positions simultaneously, ensuring that even with multiple rows, alignment is maintained and bonding reliability is preserved.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20240206259A1Display Device
Publication Date: 2024.06.20 LG DISPLAY CO LTD
  • US20240206259A1 patent drawing
  • US20240206259A1 patent drawing
  • US20240206259A1 patent drawing

AI summary

A display device according to an exemplary embodiment of the present disclosure may comprise a display panel comprising a display area and a non-display area disposed outside the display area, the display panel comprising a plurality of test signal lines and a plurality of first pads disposed in the non-display area; and a flexible circuit board comprising a plurality of second pads and a printed circuit. The plurality of second pads each comprises a body portion and an extension portion. The plurality of first pads is each connected to and overlaps each of the body portions. The plurality of test signal lines is each connected to and overlaps each of the extension portions.