Split Footprint Electrical Connector for Thinner Circuit Boards
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Solution Overview
Problem
The challenge in electrical connector systems is the high density of signal traces on circuit boards, which leads to thicker and more expensive boards due to the need for multiple layers, and increased size when routing around other components, as existing connectors do not efficiently manage trace routing and isolation.
Innovation Solution
The electrical connector system features a housing with contact modules arranged in differential pairs, with voids between groups of contacts that provide significant separation, allowing for thinner circuit boards by optimizing trace routing and reducing the need for additional layers, while also incorporating dielectric frames and shielding for electrical termination and interference control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal traces are routed in close proximity to one another to reduce connector footprint, then the connector footprint is reduced, but the circuit board requires multiple layers increasing thickness and manufacturing cost
Solution Approach 1:
The connector footprint is segmented into separate contact groups (e.g., transmit and receive contacts) with voids between them, allowing signal traces to be routed in different directions and reducing the need for multiple board layers
Solution Approach 2:
The invention changes the routing dimensionality by creating voids that allow traces to route laterally rather than vertically through multiple layers, effectively moving the routing problem from the vertical dimension to the horizontal dimension
2Area of stationary object
If signal traces are routed in close proximity to one another to reduce connector footprint, then the connector footprint is reduced, but manufacturing cost increases due to multiple layers
Solution Approach 1:
By segmenting the contact array into groups with voids between them, the invention simplifies the manufacturing process by reducing the number of board layers required, thereby lowering manufacturing costs despite maintaining a compact footprint
3Adaptability or versatility
If other components are mounted to the circuit board, then functionality is increased, but trace routing becomes more complex requiring larger board size
Solution Approach 1:
The segmented contact groups with voids provide flexible routing paths that can accommodate additional components without requiring the board to expand, as traces can route through the void spaces between contact groups
Solution Approach 2:
The voids are预先 created in the contact group layout to anticipate future routing needs, allowing traces to be routed around other components without requiring board size increases
Data Source
AI summary
An electrical connector includes contact modules each holding a plurality of contacts with dielectric frames surrounding corresponding contacts. The contacts are arranged as differential pairs each having a positive contact and a negative contact. The contacts are arranged along rows and columns with the positive and negative contacts of each pair being in the same row. The contacts are divided into a first group of contacts and a second group of contacts. The contacts within the first group of contacts have a first row pitch and the contacts within the second group of contacts have a second row pitch. A void is provided between the first group of contacts and the second group of contacts having a width at least twice the first row pitch and at least twice the second row pitch.