PCB Thermal Conductor Embedding via Copper Clad Ceramic
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Solution Overview
Problem
Conventional methods for embedding metal blocks in high-density interconnector PCBs result in copper foil wrinkling and limited circuit trace density due to high-temperature lamination processes and the use of conventional buffer materials.
Innovation Solution
A method involving stacking copper foil, cores, and bonding sheets with openings to form a thermal conductor accommodating hole, followed by a high-temperature lamination process, and then removing parts of the copper foil to expose the conductive layer of a copper-clad ceramic thermal conductor, allowing for improved circuit trace density and flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a sheet of copper foil with an opening is used before lamination, then the thermal conductor can be embedded, but the copper foil is prone to wrinkles after high-temperature lamination
Solution Approach 1:
The patent applies preliminary action by providing openings in the cores and bonding sheets before stacking, but keeping the copper foil intact without openings initially. This allows the thermal conductor to be positioned correctly during assembly while avoiding the wrinkle problem that occurs when copper foil has pre-made openings subjected to high-temperature lamination.
Solution Approach 2:
The patent segments the opening function across multiple components (cores and bonding sheets) rather than requiring the copper foil itself to have openings. This segmentation allows the thermal conductor accommodation hole to be formed through the stacking of components with openings, while the copper foil remains continuous and wrinkle-free.
2Ease of manufacture
If conventional buffer materials are used in lamination, then the lamination process can be performed, but the wrinkles are aggravated
Solution Approach 1:
The patent extracts and eliminates the conventional buffer materials (such as aluminum sheets and release films) from the lamination process. By removing these materials that tend to aggravate wrinkles, the invention achieves wrinkle-free copper foil surfaces while still enabling the lamination process to proceed successfully.
3Reliability
If openings are provided in copper foil for thermal conductor embedding, then thermal conduction is achieved, but circuit trace density is limited
Solution Approach 1:
The patent segments the opening function from the copper foil to the cores and bonding sheets. This allows the copper foil to remain continuous and support high-density circuit traces, while the thermal conductor is embedded through openings in the non-copper components. The segmentation resolves the conflict between thermal conduction requirements and circuit trace density.
Solution Approach 2:
The patent moves the opening function to a different dimensional approach by creating a three-dimensional stacked structure where openings in cores and bonding sheets align to form a through-hole for the thermal conductor. This allows thermal conduction without compromising the two-dimensional circuit trace density on the copper foil surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents copper foil wrinkling and enhances the overall density of circuit traces on the PCB by using copper-clad ceramic as the thermal conductor and forming patterns on the exposed conductive layer, improving both thermal dissipation and circuit layout efficiency.
Implementation Method 1
performing a lamination process on the stacked structure at a high temperature
Implementation Method 2
performing a lamination process at a high temperature
Implementation Method 3
performing a lamination process on the stacked structure at a high temperature
Implementation Method 4
heat generated by high-power devices on a surface of the PCB is dissipated in time due to high thermal conductivity of metals such as copper and aluminum
Data Source
AI summary
A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.