Circuit Board Alternate Component Integration via Multi-Layer Traces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional circuit boards require redesign and retesting when substituting electronic components, leading to increased costs and lead times due to their specific physical and electrical configurations being inflexible to accommodate alternate components.
Innovation Solution
A circuit board design featuring multiple trace layers and non-conductive layers that allow for the integration of different electronic components by routing traces on various surfaces and layers, enabling the board to operate with primary and secondary components without redesigning the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board is designed with specific physical geometries and electrical configurations for particular electronic components, then the circuit board can reliably accommodate those specific components, but changing or substituting electronic components demands fabrication of a new circuit board which increases cost and lead time
Solution Approach 1:
The patent implements multiple trace layers within the circuit board structure, allowing electrical connections to be routed through different dimensional planes. This multi-layer approach enables a single circuit board to accommodate multiple component configurations by switching between layers, resolving the contradiction between reliable specific design and flexible substitution capability
Solution Approach 2:
The circuit board is designed with universal compatibility for multiple electronic component types through alternate trace layer configurations. Each trace layer can be selectively activated to support different component footprints and pinouts, making the board versatile while maintaining reliable connections for each specific component type
2Adaptability or versatility
If multiple trace layers are added to enable alternate component integration, then component substitution flexibility is improved, but device complexity increases
Solution Approach 1:
The circuit board's trace network is segmented into multiple independent layers, each capable of supporting specific component configurations. This segmentation allows selective activation of trace layers based on which electronic component is installed, managing complexity by organizing connections into modular layers rather than a single complex routing system
Data Source
AI summary
A circuit board includes a first non-conductive layer and a second non-conductive layer. Additionally, the circuit board includes a first electronic component. The circuit board is configurable to operate in a first configuration with a second electronic component, and the circuit board is configurable to operate in a second configuration with a third electronic component instead of the second electronic component. Furthermore, the circuit board includes a first trace layer disposed on the first non-conductive layer. The first trace layer is configured to electrically couple the first electronic component to the second electronic component in a first configuration of the circuit board. Additionally, the circuit board includes a second trace layer disposed between the first non-conductive layer and the second non-conductive layer. The second trace layer is configured to electrically couple the first electronic component to the third electronic component in a second configuration of the circuit board.