Adhesive-Free Embedded Substrate Connection Structure
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Solution Overview
Problem
High-performance semiconductor substrates with numerous input/output terminals and transistors require large substrates, leading to increased costs due to reduced element density and yield, and existing bonding methods using adhesives are costly and difficult to manage.
Innovation Solution
A connection structure embedded substrate is developed without adhesives, where semicured or partially cured insulating material is used to bond substrates, allowing for adjacent placement and direct electrical connection via connection vias, reducing signal transmission distance and preventing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to bond the connection structure, then the connection structure can be securely attached to the substrate, but manufacturing costs increase and adhesive management becomes difficult
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the bonding process. Instead of using adhesive to bond the connection structure to the substrate, the connection structure is directly bonded through surface contact between the connection structure's bottom surface and the substrate's bonding surface, removing the need for adhesive material and simplifying manufacturing management.
Solution Approach 2:
The invention introduces a bonding surface as an intermediary interface between the connection structure and substrate. This bonding surface, formed through surface treatment or material properties, serves as a mediator that enables direct bonding without adhesive, replacing the traditional adhesive layer with a surface-based bonding mechanism.
2Reliability
If substrates are placed adjacent to each other with direct connection, then signal transmission path is shortened and electrical properties improve, but manufacturing complexity increases
Solution Approach 1:
The invention merges multiple substrates by placing them adjacent to each other in close proximity, eliminating the need for traditional stacked or separated arrangements. This merging approach shortens the signal transmission path between substrates while maintaining manufacturability through standardized bonding processes.
Solution Approach 2:
The invention transitions from vertical stacking or distant separation of substrates to a lateral adjacent arrangement. By changing the spatial dimension from vertical/remote to horizontal/adjacent, the signal transmission path is shortened without significantly increasing manufacturing complexity, as the bonding process remains similar to traditional methods.
3Adaptability or versatility
If large-sized substrates are used to accommodate numerous I/O terminals and transistors, then high-performance semiconductor functionality is achieved, but substrate price increases due to decreased element density and yield
Solution Approach 1:
The invention segments the substrate system into multiple smaller substrates arranged adjacent to each other. Instead of using one large substrate that suffers from low element density and yield, the system divides functionality across multiple compact substrates, each maintaining high element density while collectively providing the required I/O terminals and transistor capacity.
Solution Approach 2:
The invention implements a nested arrangement where multiple substrates are placed adjacent to each other in a compact configuration. This nesting approach allows efficient space utilization, enabling numerous I/O terminals and transistors to be accommodated across multiple small substrates rather than requiring a single large substrate, thereby maintaining high element density and yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, improves electrical properties by shortening signal transmission paths, and maintains high-density microcircuit performance without the need for adhesives, addressing the challenges of large substrate sizes and adhesive-related issues.
Implementation Method 1
bond a connection structure using a semicured or partially cured insulating material in the connection structure
Implementation Method 2
connect a plurality of substrates to each other through a connection via... improving electrical properties when a signal is transmitted between dies in high speed
Data Source
AI summary
A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.