Modified Polyphenylene Ether Resin for Wiring Boards
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Solution Overview
Problem
Wiring boards require low dielectric properties and high heat resistance to maintain signal transmission speed and functionality in varying environmental conditions, but existing materials fail to sustain low dielectric properties after water absorption.
Innovation Solution
A resin composition containing a modified polyphenylene ether compound with a carbon-carbon unsaturated double bond and silica as an inorganic filler, where the silica has a silanol group ratio of 3% or less, ensuring low dielectric properties and heat resistance are maintained even after water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vinyl groups are introduced to improve heat resistance, then heat resistance is improved, but dielectric properties deteriorate due to water absorption
Solution Approach 1:
The invention changes the chemical structure parameters of the polyphenylene ether by introducing specific substituents (vinyl groups at terminal positions and aromatic hydrocarbon groups at arbitrary positions) with controlled quantities and configurations. This parameter optimization allows the resin to maintain both heat resistance and low dielectric properties even after water absorption, resolving the contradiction between improving heat resistance and maintaining dielectric reliability.
Solution Approach 2:
The invention creates a composite resin system by combining modified polyphenylene ether with specific inorganic fillers and curing agents. This composite approach enables the material to achieve both improved heat resistance through crosslinking and maintained dielectric properties by selecting fillers that do not promote water absorption, thus resolving the technical contradiction.
2Reliability
If dielectric constant and loss tangent are reduced for high-frequency compatibility, then signal transmission speed is improved, but heat resistance deteriorates
Solution Approach 1:
The invention optimizes the chemical structure parameters of the polyphenylene ether backbone and substituent configurations to inherently achieve low dielectric constant and loss tangent. Simultaneously, it introduces crosslinkable functional groups that enable heat resistance improvement through curing, thus resolving the contradiction between low dielectric properties and heat resistance.
Solution Approach 2:
The invention incorporates crosslinkable functional groups (vinyl groups) in advance within the polyphenylene ether structure, allowing the material to be cured and achieve heat resistance before or during the wiring board manufacturing process. This preliminary preparation enables the material to maintain both low dielectric properties for signal transmission and improved heat resistance for reliability.
3Reliability
If water absorption is suppressed to maintain dielectric properties, then dielectric reliability is improved, but heat resistance deteriorates
Solution Approach 1:
The invention changes the resin's chemical parameters by introducing hydrophobic aromatic hydrocarbon groups and optimizing vinyl group positioning, which reduces water absorption affinity. Simultaneously, these structural changes maintain or enhance crosslinking capability with curing agents, ensuring heat resistance is achieved without compromising dielectric reliability after water absorption.
Solution Approach 2:
The invention uses specific curing agents as intermediaries that react with the vinyl groups on the polyphenylene ether to form crosslinked structures. This intermediary crosslinking process provides heat resistance while the hydrophobic structural modifications prevent water absorption, thus resolving the contradiction between dielectric reliability and heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively maintains low dielectric properties and high heat resistance, suppressing dielectric constant and loss tangent increases due to water absorption, enhancing the performance and reliability of wiring boards in humid and high-temperature environments.
Implementation Method 1
the resin contained in the substrate material is modified so as to be polymerized together with a curing agent and the like
Implementation Method 2
the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less
Data Source
AI summary
An aspect of the present invention is a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.