CPU Socket Contact Final Forming for Co-planarity
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Solution Overview
Problem
Current CPU socket designs face issues such as contact backing out during assembly, uneven solder ball contact locations due to material variations, and electrical inconsistencies, leading to solder defects and warpage during surface mount processing.
Innovation Solution
A final forming process is applied to the contact regions after initial installation into the socket housing, where the contact regions are bent over 90 degrees to secure the socket pin and prevent backing out, ensuring co-planarity and uniform solder ball placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional CPU socket designs use compression force for mechanical retention, then the integrated circuit can be placed and replaced without soldering, but contact backing out during assembly occurs and pins may bend when inserting the integrated circuit
Solution Approach 1:
The contact region is pre-configured with a stress concentration feature that enables controlled bending beyond 90 degrees. This preliminary structural design ensures that when the solder ball is attached, the contact region can be bent to a precise angle that provides both mechanical retention and prevents backing out, eliminating the need for complex compression mechanisms.
Solution Approach 2:
The contact region's geometric parameters are specifically designed with a stress concentration feature that allows it to bend beyond 90 degrees. This parameter change enables the contact to achieve a bent configuration that provides reliable retention while accommodating the solder ball attachment process without causing pin bending or contact backing out.
2Ease of manufacture
If material variations exist in conventional socket designs, then manufacturing is simplified, but uneven solder ball contact locations occur leading to electrical inconsistencies and solder defects
Solution Approach 1:
The contact region incorporates a localized stress concentration feature that creates a predictable bending point. This local structural modification ensures that regardless of material variations, the contact region will bend uniformly at the stress concentration point, achieving consistent solder ball contact locations and electrical properties across all contacts.
Solution Approach 2:
The stress concentration feature is pre-formed in the contact region during manufacturing. This preliminary action creates a controlled bending characteristic that compensates for material variations, ensuring uniform solder ball contact locations without requiring complex manufacturing processes or tight material tolerances.
3Reliability
If complex retention structures are used to prevent contact backing out, then contact retention stability improves, but device complexity and mold tooling costs increase
Solution Approach 1:
The invention extracts the retention function from complex mechanical structures and implements it through the simple bent configuration of the contact region itself. The stress concentration feature enables the contact to bend beyond 90 degrees, creating an inherent retention mechanism that eliminates the need for additional retention structures, barbs, or latches.
Solution Approach 2:
The contact region serves dual functions: electrical connection and mechanical retention. The stress concentration feature enables the contact to bend beyond 90 degrees, allowing it to self-retain the integrated circuit through its own geometry without requiring separate retention mechanisms. This self-service approach simplifies the overall device structure and reduces manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents contact backing out and ensures co-planarity among contacts, improving electrical consistency and reducing warpage and mold tooling costs by simplifying the housing geometry and reducing the complexity of retention structures.
Implementation Method 1
bending the socket pin such that the contact region is configured to receive a solder ball including securing the socket housing, striking the contact region in a first direction, and striking the contact region a second direction such that the contact region is bent more than 90 degrees from an original orientation
Data Source
AI summary
A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.