Power Backplane Hotspot Detection Grid

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Solution Overview

Problem

High-density server power backplanes face increased risks of catastrophic failure due to high current levels and heat dissipation, making it difficult to detect and prevent hotspots using traditional active temperature sensing devices, which are impractical and ineffective in monitoring the entire PCB area.

Innovation Solution

A distributed hotspot detection circuit utilizing passive temperature sensors, such as NTC thermistors, dispersed across the PCB, which do not require an external power source and can detect temperature rises, triggering a shutdown signal to prevent damage by connecting to the power supplies through a detection circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional active temperature sensing devices are used to monitor hotspots, then temperature detection capability is provided, but device complexity and system footprint increase

Engineering Contradiction:
Improvetemperature detection capabilityVSAvoidsystem footprint
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs passive temperature sensors that do not require external power sources or active control circuits. These sensors automatically detect temperature changes and generate signals that can be directly read by the controller, eliminating the need for complex active sensing infrastructure while maintaining temperature monitoring capability

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The invention extracts only the essential temperature sensing function from complex active sensing systems by using passive sensors that provide temperature detection without requiring power management, signal conditioning, or active control circuits, thereby reducing system complexity

Inventive Principle:
Principle #2Taking out (Extraction)

2Power

If high current levels are used to meet power demands, then power delivery capability is improved, but heat generation and hotspot risk increase

Engineering Contradiction:
Improvepower delivery capabilityVSAvoidheat generation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent implements temperature sensors positioned at strategic locations on the PCB that detect temperature rises before they reach dangerous levels. The controller continuously monitors these readings and can preemptively reduce current or shut down power delivery before catastrophic overheating occurs, preventing rather than reacting to the problem

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system establishes a feedback loop where temperature sensors continuously monitor PCB temperature and provide real-time data to the controller. Based on this feedback, the controller dynamically adjusts power delivery to maintain safe operating temperatures while maximizing power output, creating a self-regulating system

Inventive Principle:
Principle #23Feedback

3Power

If power density is increased to meet server demands, then power delivery is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvepower densityVSAvoidspacing precision
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

The patent places temperature sensors at multiple predetermined locations across the PCB, including areas prone to heat accumulation. This distributed sensing network provides early warning of hotspots before they cause manufacturing defects or failures, cushioning against the risks of high-power-density operation

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively monitors and prevents hotspot damage on the power backplane by detecting temperature increases before they cause harm, ensuring reliable operation and minimizing the risk of board failure without increasing system footprint or density.

Implementation Method 1

A distributed hotspot detection circuit utilizing passive temperature sensors, such as NTC thermistors, dispersed across the PCB

Methodology Applied
Scientific EffectNTC thermistor temperature sensing: Thermistor

Data Source

PatentUS11251603B2Power backplane with distributed hotspot detection grid
Publication Date: 2022.02.15 HEWLETT PACKARD ENTERPRISE DEV LP
  • US11251603B2 patent drawing
  • US11251603B2 patent drawing
  • US11251603B2 patent drawing

AI summary

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.