Insulating Cold Plate for PCB Thermal Management

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Solution Overview

Problem

Traditional power electronics assemblies with power device-embedded printed circuit boards (PCBs) face inefficiencies in cooling due to the need for electrical insulation layers and thermal interface materials, which increase thermal resistance and package size, limiting their cooling capacity and installation locations.

Innovation Solution

The integration of a cold plate with a manifold constructed from electrically insulating material and cavities housing heat sinks, directly thermally coupled to conductive layers on the PCB, reduces the need for insulation layers and thermal resistance, allowing for more efficient cooling and a compact package size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical insulation layers and thermal interface material are placed between cold plates and PCBs, then electrical isolation is achieved, but thermal resistance increases and package size increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidthermal resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a cold plate with integrated electrical insulation layers that act as an intermediary component between the PCB and heat sinks. This mediator provides both thermal conduction pathways and electrical isolation simultaneously, resolving the contradiction between achieving electrical isolation and maintaining low thermal resistance.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cold plate is constructed as a composite structure combining thermally conductive materials with electrically insulating layers. This composite design allows the same component to provide both thermal management and electrical isolation functions, eliminating the need for separate insulation layers and reducing overall thermal resistance.

Inventive Principle:

Principle #40Composite materials

2Reliability

If electrical insulation layers and thermal interface material are placed between cold plates and PCBs, then electrical isolation is achieved, but package size increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent merges the electrical insulation function with the cold plate structure itself. The insulation layers are integrated into the cold plate's construction rather than being separate components, thereby achieving electrical isolation without increasing the overall package volume.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical insulation layers are nested within the cold plate structure, with insulating layers positioned between the PCB mounting surface and the heat sinks. This nesting approach allows multiple functions (structural support, thermal conduction, electrical isolation) to occupy the same spatial envelope, reducing total package size.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Temperature

If traditional cooling components are used with power device-embedded PCBs, then cooling is provided, but cooling capacity is limited and installation locations are restricted

Engineering Contradiction:

Improvecooling capacityVSAvoidinstallation locations

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The cold plate is designed as a universal component that can be adapted to various PCB configurations and installation locations. The integrated insulation and thermal management features make it suitable for different automotive applications including in-wheel motors, providing enhanced cooling capacity while maintaining installation flexibility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances cooling capacity, reduces package size, and enables the power electronics assembly to be deployed in non-traditional spaces and integrated with existing components, such as in-wheel motor cooling systems, while maintaining efficient heat transfer and power output.

Implementation Method 1

a cold plate contacting the PCB... a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers... an inlet fluidly coupled to a dielectric coolant source... an outlet fluidly coupled to the coolant pocket

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 2

The cold plate includes a manifold constructed from an electrically insulating material

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS11856689B2Power electronics assemblies and methods of fabricating the same

Publication Date: 2023.12.26 TOYOTA JIDOSHA KK

AI summary

Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.