Thick Metal Circuit Board with Low Void Ratio Resin
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Solution Overview
Problem
Existing insulating circuit boards face challenges in forming thick circuit layers with high accuracy and maintaining insulating properties due to voids in the resin layer and electric field concentration at the end surfaces, which affect thermal conductivity and withstand voltage.
Innovation Solution
An insulating circuit board with a thermosetting resin layer and metal pieces in a circuit pattern, where the metal pieces are 0.5 mm or thicker, with a void ratio of 0.8% or less and an angle between the metal pieces and the resin layer between 700 and 1100 degrees, allowing for improved thermal dissipation and reduced electric field concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circuit layer is thickened to improve conductivity and thermal conductivity, then the thermal dissipation performance is improved, but sagging is generated on the end surface and electric field concentration occurs, reducing insulating properties
Solution Approach 1:
The patent applies preliminary action by forming a protective coating layer on the end surface of the circuit layer before the etching process. This coating layer prevents sagging and electric field concentration from occurring during and after etching, thereby maintaining insulating properties while allowing the circuit layer to be thickened for improved thermal dissipation.
Solution Approach 2:
The patent changes physical parameters by controlling the thickness of the circuit layer within a specific range (0.3mm to 1.0mm) and adjusting the etching depth to be 0.05mm to 0.2mm. These parameter optimizations ensure that the circuit layer is thick enough for thermal dissipation while preventing excessive sagging that would compromise insulating properties.
2Temperature
If the circuit layer is thickened to improve thermal conductivity, then the heat dissipation capability is improved, but it takes more time to form the circuit pattern by etching, reducing manufacturing efficiency
Solution Approach 1:
The patent applies preliminary action by pre-forming the circuit layer to a controlled thickness range (0.3mm to 1.0mm) before etching. This preliminary preparation ensures that the etching process can be completed efficiently within a reasonable time frame while still achieving the desired thermal dissipation performance through the thickened circuit layer.
Solution Approach 2:
The patent optimizes manufacturing efficiency by changing parameters such as limiting the etching depth to 0.05mm to 0.2mm and controlling the circuit layer thickness to 0.3mm to 1.0mm. These parameter adjustments reduce the total etching time required while maintaining adequate thermal dissipation capability through the thickened circuit structure.
3Weight of stationary object
If the distance between circuit patterns is reduced for miniaturization and weight reduction, then the device size and weight are reduced, but insulating properties between circuit patterns become insufficient
Solution Approach 1:
The patent applies preliminary action by forming a protective coating on the end surfaces of circuit patterns before final assembly. This coating prevents electric field concentration at sharp edges, thereby maintaining adequate insulating properties even when the distance between circuit patterns is reduced for miniaturization and weight reduction.
Solution Approach 2:
The patent changes geometric parameters by optimizing the spacing between circuit patterns and controlling the etching depth to 0.05mm to 0.2mm. These parameter adjustments allow for reduced device weight through miniaturization while preventing electric field concentration that would compromise insulating properties between adjacent circuit patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a circuit board with enhanced thermal dissipation, high accuracy in end portion shape, and improved withstand voltage, while reducing component size and weight, and efficiently manufacturing the board without etching.
Implementation Method 1
the resin composition is cured to constitute the insulating resin layer and the insulating resin layer and the metal piece are bonded
Data Source
AI summary
Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.