Black Mask Glass Cover Layout for Uniform Adhesive Curing

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Solution Overview

Problem

The existing semiconductor packages face challenges in achieving complete curing of adhesive materials due to shadowing by black mask layers, leading to incomplete adhesion and potential corrosion of bond pads/wirebonds, and issues with adhesive material height control during the encapsulation process.

Innovation Solution

The implementation of an optically transmissive cover with a black mask layer configured as a strip around the perimeter, with specific edge positioning and overhang designs to minimize shadowing and allow for uniform adhesive curing, combined with a method to control the adhesive material height by pressing and drawing the cover into the adhesive material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a black mask layer is applied adjacent to the perimeter of the optically transmissive cover, then light blocking performance is improved, but adhesive material curing is hindered due to shadowing

Engineering Contradiction:

Improvelight blocking performanceVSAvoidadhesive material curing

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The black mask layer is segmented into discrete portions positioned at specific locations around the perimeter of the optically transmissive cover, rather than forming a continuous ring. This segmentation allows light to reach adhesive material in shadowed areas while maintaining light blocking where needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the package structure receive different treatments: the black mask layer is applied locally at specific perimeter portions where light blocking is needed, while leaving other areas open for adhesive curing. This local differentiation resolves the contradiction between light blocking and adhesive curing requirements.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the black mask layer is positioned close to the perimeter, then light blocking effectiveness is improved, but adhesive material height control becomes difficult

Engineering Contradiction:

Improvelight blocking effectivenessVSAvoidadhesive material height control

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The black mask layer is divided into discrete portions with specific spacing relationships to the perimeter. This segmentation creates defined zones that facilitate precise adhesive material height control while maintaining light blocking effectiveness at critical locations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The black mask layer portions are positioned in advance at predetermined distances from the perimeter, establishing reference points that guide subsequent adhesive material application and height control processes.

Inventive Principle:

Principle #10Preliminary action

3Object-affected harmful factors

If the black mask layer completely surrounds the perimeter, then light blocking is maximized, but bond pad corrosion risk increases due to incomplete adhesive curing

Engineering Contradiction:

Improvelight blockingVSAvoidbond pad corrosion

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The black mask layer is segmented into discrete portions rather than forming a complete continuous ring. This segmentation strategically allows light access to adhesive material in critical areas near bond pads, ensuring complete curing and preventing corrosion while maintaining light blocking where needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The potential harm of incomplete adhesive curing leading to bond pad corrosion is converted into a benefit by strategically positioning black mask portions to allow necessary light exposure for complete curing, while still providing light blocking protection in other areas.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the curing of adhesive materials, reduces the risk of corrosion, and ensures uniform bondability and precise height control, thereby improving the reliability and performance of the image sensor packages.

Implementation Method 1

enhances the curing of adhesive materials

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

shadowing by black mask layers

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Data Source

PatentUS20240120355A1Black mask on glass systems and related methods

Publication Date: 2024.04.11 SEMICON COMPONENTS IND LLC

AI summary

Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.