Bleed Channel Solder Mask for Adhesive Containment

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Solution Overview

Problem

In electronic component packages, adhesives and underfills often bleed beyond the component boundaries, restricting the proximity of terminals and increasing package size due to the need to avoid covering them, which limits the density and efficiency of component placement.

Innovation Solution

The introduction of bleed channels in the solder mask around the electronic component, which capture excess adhesive or underfill, minimizing lateral spread and allowing closer terminal placement, thereby reducing the overall package size and enhancing electrical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive or underfill is applied to attach electronic component to substrate, then the electronic component is securely mounted, but the adhesive or underfill bleeds beyond the component boundaries covering terminals

Engineering Contradiction:

Improvemounting reliabilityVSAvoidadhesive bleed

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful adhesive bleed into a beneficial feature by providing dedicated bleed channels that guide the excess adhesive into controlled paths away from terminals. The adhesive bleed that would normally be harmful is now captured and directed to safe zones, eliminating the harmful effect while maintaining the secure mounting function.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The bleed channels act as intermediary structures between the adhesive application area and the terminal areas. These channels serve as mediators that intercept and redirect the adhesive flow, preventing direct contact between the adhesive and terminals while maintaining the integrity of both the mounting and terminal functions.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If terminals are placed closer to electronic component to reduce package size, then package size is reduced, but adhesive or underfill bleed covers the terminals

Engineering Contradiction:

Improvepackage sizeVSAvoidadhesive bleed coverage

Core Design Contradiction:

Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent allows terminals to be placed closer to the electronic component by converting the adhesive bleed from a harmful factor into a controlled feature through bleed channels. The bleed channels capture and redirect the adhesive flow into safe zones, enabling reduced package size without compromising terminal accessibility.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent segments the substrate surface into different functional zones: adhesive application zones, bleed channel zones, and terminal zones. This segmentation allows terminals to be positioned closer to the electronic component while maintaining clear separation between the adhesive bleed paths and terminal locations through the intervening bleed channels.

Inventive Principle:

Principle #1Segmentation

3Strength

If adhesive is applied generously to ensure proper bonding, then bonding strength is improved, but lateral spread of adhesive increases covering more terminals

Engineering Contradiction:

Improvebonding strengthVSAvoidadhesive spread area

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

The patent converts the excessive adhesive spread into a beneficial feature by providing bleed channels that capture and redirect the excess adhesive. This allows generous adhesive application for strong bonding while the bleed channels guide the lateral spread into controlled paths away from terminals, preventing coverage of terminal areas.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The bleed channels serve as intermediary structures that intercept the laterally spreading adhesive. These channels act as mediators between the adhesive application area and the terminal areas, capturing the excess adhesive flow and redirecting it into safe zones, thereby decoupling the bonding strength from the adhesive spread area.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8982577B1Electronic component package having bleed channel structure and method

Publication Date: 2015.03.17 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

A bleed channel electronic component package includes a substrate having an upper solder mask. To mount an electronic component to the substrate, an inactive surface of the electronic component is placed into an adhesive on the substrate. As the adhesive is squeezed between the electronic component and the upper solder mask, the adhesive bleeds laterally outwards past sides of the electronic component. However, bleed channels are formed in the upper solder mask directly adjacent and around the electronic component. Thus, the adhesive bleed flows into the bleed channels, and is captured therein. In this manner, the lateral spread of the adhesive bleed is minimized.