Blind Mate Connector Cooling System for Data Center Heat Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling systems for data centers face challenges in efficiently transferring heat from electrical components to a liquid coolant, particularly in maintaining optimal cooling performance and reliability across varying operational conditions.
Innovation Solution
The proposed cooling system incorporates an in-row liquid-to-air cooling unit (LACU) with a liquid-to-air heat exchanger, air flow components like fans, and a pumping unit, designed to maximize heat transfer efficiency by optimizing the surface area and air flow across the heat exchanger.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling systems are used with electrical components in data centers, then cooling function is provided, but heat transfer efficiency is insufficient and cooling performance reliability deteriorates under varying operational conditions
Solution Approach 1:
The patent changes the thermal transfer parameter by introducing a thermally conductive adhesive material between the electrical component and heat sink, replacing traditional cooling methods with higher thermal conductivity to improve heat transfer efficiency and maintain reliable cooling performance under varying operational conditions
2Loss of energy
If cooling systems with liquid coolant and heat exchangers are implemented, then heat transfer capability is improved, but system complexity and integration difficulty increase
Solution Approach 1:
The patent extracts the heat exchanger and liquid coolant system from the integration path by providing a heat sink that can be directly coupled to the electrical component without requiring complex liquid cooling infrastructure, thereby maintaining heat transfer capability while reducing system integration complexity
Solution Approach 2:
The patent introduces a thermally conductive adhesive material as an intermediary between the electrical component and heat sink, enabling effective thermal coupling without requiring complex mechanical or liquid cooling systems, thus improving heat transfer while simplifying integration
3Loss of energy
If direct thermal coupling between electrical components and heat sinks is achieved, then heat transfer efficiency is improved, but manufacturing precision and assembly difficulty increase
Solution Approach 1:
The patent changes the thermal interface parameter by using a thermally conductive adhesive material with optimized thermal conductivity and bonding properties, achieving effective thermal coupling without requiring high manufacturing precision or complex assembly procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances heat transfer efficiency, maintains reliable cooling performance under varying conditions, and allows for modular and easy integration within data center racks, improving overall data center operations.
Implementation Method 1
a thermally conductive adhesive material can be provided between the electrical component and the heat sink
Implementation Method 2
The liquid coolant can be delivered to components of electrical equipment to provide a heat transfer from those components to the heat of the liquid coolant circuit
Data Source
AI summary
A cooling system includes a pumping unit including a pump cassette and a connection assembly for establishing electrical connections between the pumping unit and the pump cassette. The connection assembly includes a printed circuit board that is connectable to the pumping unit, a first blind mate connector that is connected to the printed circuit board, and second blind mate connector that is connectable to the first blind mate connector and is connectable to the pump cassette.