Board End Face Plating for Connector Ground Contact
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Solution Overview
Problem
Conventional multilayer wiring boards require laborious processes for connecting and separating connectors due to the need for soldering, silver paste, or electroconductive adhesives to join the ground layer with the outer conductor, complicating the connection and separation of the connector to and from the board while aiming to enhance signal reflection characteristics.
Innovation Solution
A structure and method where an electroconductive end-face film is formed on the board's end face under the signal pattern, allowing direct contact with the outer conductor without the need for soldering or adhesives, enabling simple connection and separation while enhancing signal reflection characteristics by using a connector with securing portions that secure the center conductor to the signal pattern and the electroconductive film to the outer conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ground layer is directly connected to the outer conductor by joining the exposed ground portion to the outer conductor using solder, silver paste, or electroconductive adhesive, then the signal reflection characteristics are enhanced, but the connection and separation process becomes laborious and complex
Solution Approach 1:
The patent extracts the joining material (solder, silver paste, or electroconductive adhesive) from the connection process. By providing an exposed ground portion that is already conductive and directly connectable to the outer conductor without requiring additional joining materials, the invention simplifies the connection and separation process while maintaining reliable electrical connection and signal reflection characteristics
Solution Approach 2:
The patent segments the ground layer structure by exposing a specific ground portion at the end face of the board. This exposed ground portion is separated from the main ground layer and positioned to directly contact the outer conductor, creating a dedicated connection interface that simplifies the overall connection process
2Reliability
If soldering, silver paste, or electroconductive adhesive is used to join the ground layer with the outer conductor, then electrical connection is achieved, but the number of manufacturing steps and process complexity increases
Solution Approach 1:
The invention removes the need for joining materials (solder, silver paste, electroconductive adhesive) from the manufacturing process. The exposed ground portion is designed to be directly connectable to the outer conductor through simple contact, eliminating multiple manufacturing steps such as soldering, paste application, or adhesive coating
Solution Approach 2:
The ground portion is pre-exposed during board fabrication at the end face, creating a ready-to-connect interface before the connector is attached. This preliminary preparation eliminates the need for additional joining operations during assembly, simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal reflection characteristics and simplifies the connection and separation process by eliminating the need for soldering or adhesives, resulting in improved insertion loss performance and ease of use, particularly in radio-frequency signal transmission circuits.
Implementation Method 1
an electroconductive end-face film formed on an end face of an end portion of the board
Data Source
AI summary
A structure that includes a board and a connector secured to an end portion of the board. The board has a first dielectric layer, a signal pattern that is provided on the top face of the first dielectric layer, a first ground layer that is provided under the first dielectric layer and forms part of a signal transmission circuit in conjunction with the signal pattern, and a plating film formed on an end face of the end portion of the board in an area located directly under the signal pattern and includes an end face of the first ground layer. The connector has a center conductor, an outer conductor, and securing portions that secure the connector to an end portion of the board. When the connector is secured, the center conductor comes in contact with the signal pattern and the plating film comes in contact with the outer conductor.