Printed Circuit Assembling TRIZ Cases

A multi-layer wiring board integrates fine-pitch components via a carrier that transforms electrode pitch, resolving alignment accuracy constraints.

Plate-like inorganic filler reduces coefficient of thermal expansion below 20 ppm/K while maintaining coating properties.

Embedded planar transient protection material integrates into the printed circuit board stackup to provide bi-directional voltage clamping.

A magnetic sensor design uses shared power supply and ground terminals across multiple electric current path units to reduce overall device dimensions.

A passive bias temperature compensation circuit module stabilizes silicon photomultiplier gain using thermal coupling and voltage division.

Stepwise exposure creates varying solder resist heights that support fine circuit patterns, preventing collapse and enhancing reliability.

A 3D suspended lattice structure on circuit substrates contains conductive epoxy to prevent thermal cycling separation and electrical shorts.

A heat conduction pattern on an interposer connects surface points to enable selective heating of stacked printed circuit boards.

Segmented sink plates and a thermally insulating cover redirect heat from wide band amplifier packages, lowering operating temperatures.

A circuit assembly uses deformable conductive material within insulating layers to form reliable electrical contacts without soldering.

Flexible multilayer construction with fiducial alignment marks guides conductive material flow into pad grooves to secure LED terminals.

Variable depth micro-channels guide cured conductors into uniform micro-wires, resolving the trade-off between transparency and conductivity in touch screens.

A nonreciprocal circuit device uses a composite resin layer with magnetic fillers to provide magnetic shielding for ferrite components.

Differential adhesive layers on dual support members constrain component position during resin sealing, eliminating warpage and terminal contamination.

Protrusions on the coverlay body extend toward circuit patterns to block foreign particle and moisture permeation, improving display device reliability.

Row separation of chip modules eliminates complex transport devices, reducing mechanical complexity and temporal expenditure during antenna assembly.

Curled connecting elements maintain pretension against thermal expansion and relaxation, preserving image sensor alignment in camera modules.

Electroconductive end-face film on a board enables direct outer conductor contact without soldering.

An automotive luminous device couples electronic substrates using an abutment part to press contact zones together for reliable electrical connection.

Variable velocity control decelerates carrier tape feeding at critical points, preventing component flipping and misorientation during chip mounting.

An overmolded conductive assembly positions connection tabs under a non-conductive support, preventing solder residue migration and false intrusion detection.

Adjustable pump output manages evacuation gradients to prevent void bursting and flux scattering while achieving target vacuum levels quickly.

Magnets secure cell leads to interconnect circuit boards, eliminating time-consuming welding processes and specialized equipment requirements.

A low-viscosity solder resist composition enables inkjet printing of fine circuit structures below 50 µm.

Bonding resin and reinforcing plate prevents separation, enabling low-profiling without increasing casing thickness.

Stacking an inorganic insulating film on an organic layer prevents dry-etching damage, reducing faulty connections in terminal areas.

Fixture aligns electrical interposers and receptacles for simultaneous solder reflow, preventing helium leakage gaps in sealed hard disk drives.

Segmented reversible lid applies perpendicular force to reduce substrate warpage, then removes to prevent thermal gradients.

Tin-based lead-free solder incorporating a nickel-iron alloy suppresses melting and splashing during reflow, preventing short circuits from positional shifting.

Segmented metal frame absorbs piezoelectric vibrations in multilayer ceramic capacitors, eliminating acoustic noise deviations caused by solder variations.

Segmented insulating layers prevent underfill resin overflow and resist cracking during high-density component mounting on the board.

Segmented legs with foot members grasp openings in a secondary device, resolving soldering difficulties while maintaining reliable electrical contact.

A stacked ceramic capacitor mounting structure absorbs electric-field-induced strain through series-connected components with varying capacitance ratios.

A layered composite with a sinterable metal powder layer and solder layer forms stable joints.

Specific Bi, Cu, and Ni ranges suppress P-rich layer growth at the interface to prevent substrate strain and improve shear strength.

A vertical surface mount fuse uses an integrated lead frame to provide direct pass-through connections.

Protruding button heads on soldering pads segment contact areas, preventing solder bridging between adjacent traces in high-density microelectronic assemblies.

A dual-layer adhesive system joins flexible circuit boards using distinct material properties to secure attachment.

A stacked circuit board structure integrates a master storage unit with a slave control module to reduce device volume.

Laminating photosensitive dry film creates a robust under-fill dam that prevents leakage during high-density IC mounting.

Conductive paste sintering creates cone-shaped pillars that reduce production costs and improve electro-migration resistance in fine pitch packages.

Curved spires on a center pad redirect surface tension to apply balancing forces that self-align integrated circuit packages during soldering.

A bonding material uses low viscosity resin to fill gaps between electrode parts and secure metal particles.

An insulating layer forms over conductive traces to maintain electrical isolation from wider bumps during flip-chip bonding.

Selective deposition and fusion replace slow CNC cutting, reducing production time from weeks to days.

A semiconductor base embeds radio-frequency devices using conductive seed layers and lamination to form thick copper structures.

A stacked power supply converter integrates a pre-sintered magnetic substrate with an inductance coil to achieve high current density.

Segmented substrates and stepped shielding reduce mounting height while preventing deformation-induced noise in endoscope devices.

A printed circuit assembly integrates a wave absorber and grounded blocking sheet to shield processors and oscillators from electromagnetic interference.

A printed wiring board uses a dual-metal surface layer to connect fine-pitch pads via specific conductor paths.