Vacuum Soldering Pump Control for Void Prevention

The patent applies dynamics by making the pump output adjustable rather than fixed. The control unit dynamically changes the pump output from low to high based on the current vacuum degree, allowing the system to adapt its evacuation speed to the actual process needs. This resolves the contradiction by enabling both gentle initial evacuation (when voids are large) and rapid final evacuation (when vacuum is near target), thus improving both reliability and productivity.

The patent changes the operational parameter of pump output based on the vacuum degree. By monitoring the vacuum degree and adjusting the pump output accordingly, the system optimizes the evacuation process at different stages. This parameter change approach allows the system to prevent void bursting during early evacuation while achieving rapid vacuum attainment later, resolving the productivity-reliability contradiction.

The system dynamically adjusts the evacuation gradient based on real-time vacuum degree feedback. When the vacuum degree is low (early stage), the pump operates at low output to create a gentle gradient that prevents void bursting. When the vacuum degree approaches the target level, the pump output increases to high, creating a steeper gradient that reduces total evacuation time. This dynamic adjustment resolves the contradiction between gentle evacuation and fast evacuation.

The evacuation process is divided into multiple stages with different pump outputs. The control unit periodically adjusts the pump operation based on vacuum degree thresholds, creating a multi-phase evacuation sequence. This periodic action allows the system to apply different evacuation intensities at appropriate times, preventing void bursting while minimizing total evacuation time.