Interposer Heat Conduction Pattern for Selective PCB Repair
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Solution Overview
Problem
Existing methods for repairing printed board assemblies (PBAs) with multiple stacked PCBs and interposers face challenges in selective heating, often leading to pad detachment during the peeling process.
Innovation Solution
The implementation of a heat conduction pattern on the interposer, which connects specific points on its surface, allows for selective heating of desired areas, preventing pad detachment and enabling precise separation or bonding of soldering parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If infra-red (IR) heating type is used to heat the entire surface of each PCB or the entire interposer, then the heating coverage is complete, but it becomes difficult to selectively heat the desired part to be detached and pad detachment may occur
Solution Approach 1:
The heating function is segmented into multiple independent heating patterns (first heating pattern, second heating pattern, third heating pattern) that can be selectively activated. Each heating pattern corresponds to a specific region or function, allowing selective heating of desired parts without heating the entire interposer or PCB surfaces.
Solution Approach 2:
Different regions of the interposer are equipped with different heating patterns tailored to their specific functions. The first heating pattern heats the soldering part region, the second heating pattern heats the pad region, and the third heating pattern heats the component region. This localized heating approach enables precise temperature control for each function while avoiding unnecessary heating of other areas.
2Ease of manufacture
If the stacked structure is peeled using conventional heating type, then the separation process is simple, but pad detachment occurs
Solution Approach 1:
The heating process is segmented into distinct phases with different heating patterns. During the peeling process, the second heating pattern is activated to selectively heat the pad region, maintaining pad temperature and preventing detachment while allowing the separation process to proceed.
Solution Approach 2:
Before peeling, the heating patterns are pre-configured on the interposer. The control circuit can activate the appropriate heating pattern (second heating pattern for pad region) in advance or during the peeling process to prevent pad detachment, ensuring reliability before the mechanical separation occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and precise control over the heating process, allowing for selective separation and bonding of components in stacked structures, even with multiple interposers, thereby improving repair accuracy and preventing damage to the PCBs.
Implementation Method 1
a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point
Implementation Method 2
an electric current may be applied to the designated pattern so as to separate and/or bond soldering parts of the circuit board
Data Source
AI summary
According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.