Stacked Circuit Board Structure for Ultra-Slim Data Storage

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Solution Overview

Problem

Current ultra-slim electronic devices cannot effectively accommodate longer circuit boards, limiting data storage capacity and functional expansion due to space constraints.

Innovation Solution

A stacked structure comprising a master circuit board with flash memories and a slave circuit board equipped with an operation management chip, connected via specific transmission interfaces and connectors, allowing for reduced volume and enhanced monitoring and control capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a longer circuit board is used to accommodate more electronic elements and expand functions, then data storage capacity and functional expansion are improved, but the volume of the electronic device increases and cannot be accommodated in ultra-slim devices

Engineering Contradiction:
Improvefunctional expansionVSAvoiddevice volume
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked architecture. The master circuit board and slave circuit board are arranged vertically along the thickness direction, allowing multiple functional modules to coexist in a limited footprint. This dimensional change enables ultra-slim devices to accommodate expanded functionality without increasing planar dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system is divided into functionally independent circuit boards: a master circuit board for data storage and a slave circuit board for monitoring and control operations. Each board contains specific electronic elements suited to its function, allowing modular integration and reducing the need for a single large board to accommodate all functions.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If a longer circuit board is used to accommodate more electronic elements, then data storage capacity is improved, but the area occupied by the circuit board increases

Engineering Contradiction:
Improvedata storage capacityVSAvoidcircuit board area
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The patent utilizes the thickness dimension to stack multiple circuit boards vertically. The master circuit board accommodates flash memories for data storage, while the slave circuit board handles monitoring and control functions. This vertical arrangement increases functional capacity without expanding the planar area occupied by the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If more electronic elements are equipped on the circuit board to expand functions, then monitoring and control capabilities are improved, but the complexity of the circuit board increases

Engineering Contradiction:
Improvemonitoring and control capabilitiesVSAvoidcircuit board complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent separates monitoring and control functions onto a dedicated slave circuit board, distinct from the master circuit board that handles data storage. This segmentation isolates complexity to specific modules, making the overall system more manageable and maintainable while expanding functional capabilities.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The slave circuit board integrates multiple functions including operation monitoring, control指令 transmission, and network communication through a single integrated module. This multi-functional design reduces the need for separate dedicated circuits for each function, thereby managing complexity while expanding capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11464111B2Stacked structure of circuit boards
Publication Date: 2022.10.04 INNODISK CORP
  • US11464111B2 patent drawing
  • US11464111B2 patent drawing
  • US11464111B2 patent drawing

AI summary

The invention provides a stacked structure of circuit boards applied to a data storage device. The stacked structure comprises a main circuit board and a slave circuit board. The main circuit board comprises a controller, a plurality of flash memories, a first connector, and a first transmission interface. The slave circuit board comprises an operation management chip, a second connector, and a second transmission interface. The operation management chip comprises a microprocessor and a network communication element. The slave circuit board is stacked on the main circuit board, and connected to the first connector of the main circuit board via the second connector. When the slave circuit board receives a specific operation instruction, the microprocessor of the slave circuit board will transmit the specific operation instruction to the electronic apparatus via the second transmission interface, the electronic apparatus executes a corresponding operation according to the specific operation instruction.