Metal Frame for Multilayer Ceramic Capacitor Noise Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors in electronic devices generate acoustic noise and warpage due to piezoelectric vibrations, which can lead to faulty device perceptions and electrical issues, and existing metal frames for stress absorption are sensitive to solder amount and shape, causing deviations in noise reduction and mechanical strength.
Innovation Solution
A metal frame design with inner and outer support portions and a connecting portion is bonded to the external electrodes of the multilayer ceramic capacitor, featuring a 'C' or 'L' shape configuration, and conductive adhesive layers are used to absorb vibrations and stress, regardless of solder amount or shape, thereby reducing acoustic noise and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal frame is attached to the external electrode to absorb stress, then acoustic noise and warpage are reduced, but the stress absorbing effect and acoustic noise reducing effect show deviations depending on the amount and shape of solders
Solution Approach 1:
The metal frame is divided into three distinct portions: an inner support portion, an outer support portion, and a connecting portion. This segmentation allows each portion to independently perform its function - the inner support portion absorbs stress from the capacitor body, the outer support portion provides mounting stability, and the connecting portion transmits vibrations to the board for noise reduction. This structured division eliminates deviations caused by variable solder amounts and shapes.
Solution Approach 2:
Different portions of the metal frame are designed with specific local functions: the inner support portion is positioned to directly contact and support the capacitor body for stress absorption, while the outer support portion is designed for stable mounting on the board. This localized functional design ensures that each region of the metal frame performs its designated role effectively, reducing acoustic noise and warpage without deviations regardless of solder variations.
2Ease of manufacture
If the metal frame structure is simplified, then manufacturing is easier, but the effectiveness in reducing acoustic noise and warpage decreases
Solution Approach 1:
The metal frame is segmented into three portions that can be formed through simple folding processes, making manufacturing easy while maintaining effectiveness. The inner support portion, outer support portion, and connecting portion are created through sequential folds, allowing each to perform its specific function in noise reduction and warpage prevention without complex fabrication.
Solution Approach 2:
The metal frame utilizes three-dimensional spatial arrangement with the inner support portion, outer support portion, and connecting portion positioned at different locations and orientations. This dimensional configuration enables effective stress absorption and vibration transmission while maintaining manufacturing simplicity through folding operations that create the required spatial structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively absorbs vibrations and mechanical stress, reducing acoustic noise and preventing warpage cracks in multilayer ceramic capacitors, maintaining mechanical strength and noise reduction across varying solder conditions.
Implementation Method 1
since the dielectric layers have piezoelectric properties, when direct current (DC) or alternating current (AC) voltages are applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes to generate periodic vibrations
Data Source
AI summary
An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.