Chip Module Application to Antenna via Row Separation
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Solution Overview
Problem
The existing methods for equipping antennas with chip modules in large-scale production are inefficient due to complex mechanical handling and conveyance requirements, especially with wide antenna module webs, leading to temporal and logistical challenges.
Innovation Solution
A method where multiple chip modules are arranged in a row on a sheet carrier, supplied to a separating device near the application location, and then separated and positioned on an antenna substrate using a simple forward movement, eliminating the need for complex transport devices and allowing for efficient alignment and adhesively bonded connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip modules are supplied separately to the application location via complex transport devices, then the antenna modules can be equipped with chip modules, but the mechanical complexity and temporal expenditure increase significantly
Solution Approach 1:
The patent merges the supply function and the application function into a single integrated system. The sheet carrier with row arrangements of chip modules is conveyed directly to the application location, where separation and application occur in one continuous process. This eliminates the need for separate transport devices and intermediate handling steps, thereby reducing mechanical complexity while maintaining productivity.
2Ease of operation
If chip modules are supplied separately beforehand, then the application process can proceed, but the transport devices become correspondingly complex in design
Solution Approach 1:
The patent segments the chip module supply into row arrangements on a sheet carrier, which are then separated individually at the application location. This segmentation allows the bulk handling of multiple chip modules in a simple row configuration, eliminating the need for complex individual transport devices. The separation occurs only where needed, simplifying the overall handling system.
3Manufacturing precision
If extensive manipulation zones are used for conveying chip modules, then the chip modules can be positioned on antenna substrates, but the equipment requires passage through complex zones
Solution Approach 1:
The patent performs preliminary alignment and positioning actions while the row arrangements are still on the sheet carrier during conveyance. The separating device and application device are pre-positioned at the application location, ready to receive and process the chip modules as they are conveyed. This eliminates the need for extensive manipulation zones, as the essential positioning is achieved during the straightforward conveyance process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the handling and conveyance of chip modules, reducing mechanical complexity and enabling faster, more efficient contact and bonding with antenna modules, while maintaining precise alignment and achieving a mechanically resistant connection.
Implementation Method 1
By means of which the row arrangement is guided out of a supply channel until a rear longitudinal end of the foremost chip module in the supply channel is brought into contact with a first fixed cutting edge of the separating device
Implementation Method 2
it has proven advantageous if subsequent to the positioning and preceding the contacting an adhesively bonded connection is established between the chip module and the antenna substrate in a contact region surrounding a chip and the antenna contact surfaces
Implementation Method 3
antenna contact surfaces formed on an application side of the chip module are contacted with contact surfaces of an antenna disposed on an antenna side of an antenna substrate in an electrically conductive manner
Data Source
AI summary
A method for application of a chip module to an antenna module includes supplying a plurality of chip modules arranged in a row arrangement on a sheet carrier. Separating chip modules from the row arrangement and transferring the separated chip modules to a application device. The chip module separated from the row arrangement are subsequently positioned on the antenna substrate by the application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.