Stacked Power Supply Converter with Pre-Sintered Magnetic Substrate
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Solution Overview
Problem
Designing a power supply converter with high integration density and efficiency is challenging due to the limitations of magnetic materials and inductance coil design in switching power supply conversion schemes, particularly for large current applications.
Innovation Solution
A power supply converter is developed using a stacked structure with a pre-sintered magnetic substrate and an inductance coil, where the magnetic substrate is sintered before further manufacturing, allowing for the selection of suitable magnetic materials and achieving high current requirements, and the inductance coil is formed with thin metal layers and multiple turns to reduce parasitic parameters and improve switching frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional switching power supply conversion scheme with magnetic elements, capacitive elements and switching elements is used, then power conversion function is achieved, but integration density is low and volume is large
Solution Approach 1:
The patent merges the magnetic element (inductance coil), power element (semiconductor device), and capacitive element into a single integrated module. The inductance coil is formed directly on the magnetic substrate with vias that serve as capacitive structures, eliminating the need for separate discrete components and achieving high integration density while reducing overall volume.
Solution Approach 2:
The patent transitions from planar arrangement of components to three-dimensional vertical integration. The stacked configuration with the inductance coil on the magnetic substrate and vias extending through multiple layers enables compact packaging in the vertical dimension, significantly reducing the footprint area while maintaining all necessary functional elements.
2Speed
If conventional inductance coil design is used, then energy storage function is achieved, but parasitic parameters are high and switching frequency is limited
Solution Approach 1:
The patent changes the physical parameters of the inductance coil by forming it with thin metal layers (5-20 micrometers) instead of conventional thick wires, and by optimizing the coil geometry on the magnetic substrate. This reduces parasitic resistance and enables higher switching frequencies while maintaining energy storage function.
Solution Approach 2:
The patent replaces conventional wire-wound inductors with a planar spiral inductance coil formed by depositing metal layers on the magnetic substrate. This substitution eliminates mechanical winding parasitics and enables integration with semiconductor devices, reducing overall parasitic parameters and enabling higher frequency operation.
3Reliability
If magnetic substrate is sintered after assembly, then manufacturing flexibility is maintained, but manufacturing precision and reliability are reduced
Solution Approach 1:
The patent performs preliminary sintering of the magnetic substrate before assembling the inductance coil and semiconductor devices. This preliminary action ensures the magnetic substrate has optimal magnetic properties and structural stability before subsequent manufacturing steps, improving overall reliability while maintaining manufacturing flexibility through standardized pre-sintered substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves high power density and efficiency, suitable for large current applications, with the ability to operate at high frequencies and provide low voltage and large current outputs, while maintaining a compact and thin form factor.
Implementation Method 1
a pre-sintered magnetic substrate, provided with a via, the first magnetic substrate including a first surface and a second surface
Implementation Method 2
the magnetic substrate is sintered before further manufacturing, allowing for the selection of suitable magnetic materials
Implementation Method 3
an inductance coil, formed at the via and connected with the first pin and the second pin respectively
Data Source
AI summary
A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.