Organic-Inorganic Film Stack for Display Substrate Reliability
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Solution Overview
Problem
Conventional display device substrates face issues with microfabrication of lines and faulty connections due to the poor mechanical strength and processability of organic insulating films, leading to reliability concerns, especially when connecting external components like FPC boards.
Innovation Solution
A display device substrate with an organic-inorganic film stacked body, where an inorganic insulating film is directly formed on an organic insulating film to enhance mechanical strength and processability, allowing precise microfabrication and reducing faulty connections by using dry-etching techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an organic insulating film is used in the terminal area, then planarization and flexibility are improved, but mechanical strength and processability deteriorate, leading to damage during processing
Solution Approach 1:
The patent applies composite materials by stacking an inorganic insulating film (such as silicon oxide or silicon nitride) on top of the organic insulating film in the terminal area. This composite structure combines the planarization and flexibility benefits of the organic film with the mechanical strength and processability of the inorganic film, preventing damage during dry-etching and other processing steps.
2Manufacturing precision
If dry-etching is used for microfabrication, then manufacturing precision is improved, but the organic insulating film is damaged due to poor processability
Solution Approach 1:
The inorganic insulating film serves as an intermediary protective layer between the dry-etching process and the organic insulating film. It allows the use of precise dry-etching techniques for microfabrication while protecting the organic film from damage, thereby maintaining both manufacturing precision and connection reliability.
3Ease of operation
If the organic insulating film is removed in the terminal area, then access to connection terminals is improved, but corrosion and faulty connections occur due to exposure
Solution Approach 1:
The patent applies local quality by selectively removing the organic insulating film only in specific regions where connection terminals need to be accessed, while maintaining the organic film in other areas. The inorganic insulating film is then formed to provide localized protection against corrosion and faulty connections in the terminal area, achieving both terminal access and protection.
Data Source
AI summary
The present invention provides a display device substrate that enables microfabrication of lines and is capable of reducing faulty connection and enhancing the reliability of display devices including the display device substrate, a method for producing the display device substrate, a display device, a method for forming a multilayer wiring structure, and a multilayer wiring board. The display substrate of the present invention includes an insulating substrate and includes at least one of a terminal area having a connection terminal to be connected to an external connection component and a peripheral circuit region having a peripheral circuit formed thereon, on the insulating substrate. The display device substrate includes an organic insulating film and an inorganic insulating film, and the inorganic insulating film is stacked directly on and above the organic insulating film such that an organic-inorganic film stacked body is formed.