Thermosetting Resin Bonding Material for Electronic Device
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Solution Overview
Problem
Existing soldering methods using thermosetting resin and activating agents face challenges in ensuring sufficient fluidity of solder particles, leading to inadequate bonding and mechanical strength, and are prone to void gaps, which compromise electrical and mechanical reliability, especially under thermal stress and high-humidity conditions.
Innovation Solution
A bonding material comprising metal particles, a thermosetting resin, and an activating agent, where the viscosity of components is kept at 0.57 Pa·s or less at the metal particles' melting point, and the activating agent is activated below the melting point, ensuring the metal particles flow and bond effectively before the resin cures, filling gaps between electrode bonding parts with thermosetting resin to enhance mechanical strength and insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the curing temperature of the thermosetting resin is set higher than the melting point of the solder particles, then the solder particles can flow and move sufficiently in the thermosetting resin, but the viscosity of the thermosetting resin increases, which hinders the fluidity of the solder and reduces bonding quality
Solution Approach 1:
The patent changes the chemical composition parameters of the thermosetting resin by adding specific plasticizers (phthalate esters, carboxylic acid esters, or sulfonate esters) to reduce viscosity. This allows the resin to maintain low viscosity even at higher curing temperatures, enabling solder particles to flow sufficiently while avoiding the harmful viscosity increase that would hinder bonding quality.
Solution Approach 2:
The patent introduces plasticizers as intermediary substances between the thermosetting resin and solder particles. These plasticizers act as mediators that reduce the viscosity of the resin matrix, allowing solder particles to move more freely through the resin during the bonding process, thereby improving bonding quality without requiring excessive temperature increases.
2Ease of manufacture
If conventional solder paste is used, then the process is simple, but void gaps form between electrode bonding parts, compromising mechanical strength and electrical reliability
Solution Approach 1:
The patent creates a composite solder paste material that combines solder particles with a specially formulated thermosetting resin containing multiple plasticizers and a multi-component activating agent system. This composite formulation prevents void gap formation by ensuring complete wetting and filling of bonding interfaces, while maintaining process simplicity through a single paste application that undergoes sequential oxide removal, solder melting, and resin curing in one heating cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures robust mechanical strength, reliable electrical connections, and improved insulation properties by preventing void gaps and structural defects, maintaining bonding integrity under thermal stress and in humid environments.
Implementation Method 1
metal particles that are melted at a first temperature T1
Implementation Method 2
the activating agent and the solder particles undergo an oxidation-reduction reaction on the surface of the solder particles thereby to remove an oxide layer that is present on the surface of the solder particles
Implementation Method 3
a thermosetting resin that is cured at a second temperature T2 that is higher than the first temperature T1
Implementation Method 4
a viscosity of contained components except the metal particles at the first temperature T1 is 0.57 Pa·s or less
Data Source
AI summary
An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1−T3<50° C.