Resin-Sealed Package Terminal Alignment via Dual Support Adhesion
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Solution Overview
Problem
Resin-sealed semiconductor packages face issues with warpage and positional displacement due to the use of support members, leading to contamination and asperities on terminal faces, which hinder the formation of accurate and fine-pitch wirings.
Innovation Solution
A method involving two support members with different adhesive properties is used to fix electronic components between them, allowing for uniform alignment and resin sealing, reducing warpage and distortion, and enabling the formation of flat terminal faces and fine-pitch wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a support member is used to temporarily bond electronic components during resin sealing, then the components can be held in position for mounting, but the resin may enter between the terminals and support member causing contamination, and the pressure in injection may cause positional displacement
Solution Approach 1:
The invention extracts the support member from the final package structure, using it only temporarily during the sealing process. The support member is designed to be removed after resin curing, leaving no residual support structure that could interfere with terminal alignment or cause contamination. This extraction principle resolves the contradiction by providing temporary positioning support during manufacturing while ensuring the final product has only the electronic components with accurate terminal alignment.
Solution Approach 2:
The invention applies preliminary action by pre-aligning the electronic components on the support member before resin injection. The support member is designed with features that ensure proper positioning and alignment of components prior to the sealing process. This preliminary alignment prevents positional displacement during resin injection and ensures accurate terminal alignment in the final package.
2Ease of manufacture
If the support member is peeled away after resin curing, then the package can be completed, but the resin surface may warp and asperities may be produced on the front face
Solution Approach 1:
The invention applies parameter changes by controlling the resin curing process parameters, including temperature, pressure, and curing time, to minimize resin shrinkage and warpage. The resin formulation is also optimized to reduce shrinkage during curing. These parameter changes ensure that the resin surface remains flat even after support member removal, resolving the contradiction between easy manufacturing and surface precision.
Solution Approach 2:
The invention uses beforehand cushioning by designing the support member with a structure that distributes stress evenly during resin curing and removal. The support member is designed to minimize warpage induction during the peeling process. This cushioning approach prevents resin surface warpage and asperities, ensuring flat surfaces while maintaining ease of support member removal.
3Manufacturing precision
If terminal faces are aligned in the same plane during sealing, then uniform alignment can be achieved, but the process complexity increases and requires precise control
Solution Approach 1:
The invention uses the support member as an intermediary that provides a common reference plane for aligning multiple electronic components. The support member includes alignment features such as positioning protrusions or recesses that ensure all components are positioned with their terminal faces in the same plane. This intermediary approach simplifies the alignment process by providing a unified reference structure, reducing process complexity while maintaining high alignment precision.
Solution Approach 2:
The invention applies homogeneity by ensuring all electronic components are mounted on the same support member with identical alignment features. This creates a homogeneous alignment reference system where all components are positioned relative to the same standard, ensuring uniform terminal face alignment. The homogeneous approach reduces complexity by eliminating the need for different alignment methods for different components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the terminal faces of electronic components are uniformly aligned, reducing positional displacement and warpage, allowing for accurate wiring formation and improved heat dissipation in semiconductor packages.
Implementation Method 1
temporarily fixing an electronic component to a support member by an adhesive agent layer
Implementation Method 2
resin sealing the electronic component between the support members
Implementation Method 3
fixing the second support member having a second adhesive agent layer to the electronic component... in a state where a peeling force of the second adhesive agent layer is larger than a peeling force of the first adhesive agent layer
Data Source
AI summary
A method of producing a resin-sealed package is provided with: providing an electronic component which has a plurality of terminals on one face, a first support member and a second support member; temporarily fixing said electronic component to a surface of said first support member by a first adhesive agent layer, to face said terminals with said first support member; fixing said second support member having a second adhesive agent layer to said electronic component while interposing said electronic component between said first support member and said second support member to face said second adhesive agent layer with a back face side of said electronic component; resin sealing said electronic component between said first support member and said second support member; peeling said first support member and said first adhesive agent layer from said electronic component and a sealing resin; and stacking an insulating resin layer and a wiring layer which is electrically connected to said terminals of said electronic component, on said electronic component and said sealing resin.