Deformable Conductive Material for Flexible Electrical Connections
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Solution Overview
Problem
Conventional methods for creating electrical connections between components often require soldering or other complex processes, which can be costly and unreliable, especially in applications where flexibility and durability are needed.
Innovation Solution
A circuit assembly using a substrate with a pattern of deformable conductive material contact points and conductive traces, allowing for electrical connections to be formed without soldering, using materials like silicone-based materials and conductive gels, and incorporating multiple layers of insulating material with passageways for deformable conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or complex processes are used to create electrical connections, then connection strength and reliability are improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent replaces the mechanical soldering process with a deformation-based electrical connection system. Deformable conductive material is mechanically deformed to create electrical contact with component terminals, eliminating the need for soldering processes while maintaining reliable electrical connections. This substitution reduces manufacturing complexity and cost while preserving connection reliability.
Solution Approach 2:
The patent utilizes changes in the physical state and properties of deformable conductive material through mechanical deformation. The material transitions from a deformable state during assembly to a stable contact state, enabling electrical connection without soldering. This parameter change approach simplifies the manufacturing process while ensuring reliable connections.
2Reliability
If soldering processes are used, then electrical connections are formed, but flexibility and durability of the circuit assembly are reduced
Solution Approach 1:
The patent employs deformable conductive material that can dynamically adapt to mechanical stresses and deformations. The material's ability to deform and recover allows the circuit assembly to maintain flexible and durable connections, unlike rigid soldered joints. This dynamic property enables the assembly to withstand bending, stretching, and other mechanical stresses while maintaining electrical connectivity.
Solution Approach 2:
The patent uses composite structures combining deformable conductive material with insulating layers and substrates. This composite approach allows the conductive material to provide flexibility and durability while the surrounding structures provide mechanical support and electrical insulation, achieving both flexibility and connection reliability.
3Reliability
If conventional electrical connection methods are used, then connections are formed, but manufacturing cost increases
Solution Approach 1:
The patent replaces costly soldering processes with a simpler mechanical deformation process. The deformable conductive material is shaped and positioned to make direct contact with component terminals, eliminating the need for soldering equipment, flux, and associated manufacturing steps. This substitution significantly reduces manufacturing cost while maintaining connection reliability.
Solution Approach 2:
The deformable conductive material can be designed as a cost-effective, easily replaceable component. If needed, the entire deformable conductor can be replaced without complex rework, similar to a disposable component. This approach reduces manufacturing cost and simplifies repair and replacement processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables flexible and reliable electrical connections without the need for soldering, reducing costs and improving reliability by using deformable conductive materials and layered insulating structures, suitable for various electronic components and applications.
Implementation Method 1
deformable conductive material disposed within the channels
Implementation Method 2
The deformable conductive material may be formed from any suitable conductive material including conductive gels, metalloids, metals, or any other conductive material
Data Source
AI summary
A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material. The second layer of insulating material at least partially encloses the deformable conductive material in the at least one passage in the first layer of insulating material, and unitizing the first and second layers in a unitizing operation