Cascaded Board Power Conversion for Isolation and Heat Dissipation
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Solution Overview
Problem
ICT devices face challenges in power supply efficiency, heat dissipation, and energy consumption due to increasing bandwidth, data transfer rates, and processing demands, necessitating improved power delivery to service boards.
Innovation Solution
A power supply system incorporating a first isolated voltage conversion unit and multiple non-isolated voltage conversion units, including field effect transistors and capacitors, to efficiently convert and distribute power to load modules on service boards, enhancing voltage conversion efficiency and heat dissipation through whole-board heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an isolated voltage conversion unit is used for on-board power supply, then power supply isolation and safety are improved, but voltage conversion efficiency deteriorates and heat dissipation becomes difficult
Solution Approach 1:
The patent divides the voltage conversion system into two segments: an isolated voltage conversion unit for main power conversion and a non-isolated voltage conversion unit for secondary voltage adjustment. This segmentation allows each unit to be optimized for its specific function, with the non-isolated unit achieving higher efficiency due to fewer magnetic components and lower parasitic losses.
Solution Approach 2:
The patent merges the isolated and non-isolated voltage conversion units into a cascaded system where the output of the first unit feeds into the second unit. This combination allows the system to benefit from both the isolation/safety of the isolated unit and the high efficiency of the non-isolated unit, resolving the contradiction between safety and efficiency.
2Reliability
If an isolated voltage conversion unit is used for on-board power supply, then power supply isolation is improved, but circuit height and heat dissipation efficiency deteriorate
Solution Approach 1:
By separating the isolated voltage conversion (first unit) from the non-isolated voltage conversion (second unit), the patent enables the second unit to have a lower profile height since it doesn't require bulky magnetic components. This allows for more effective heat dissipation through the PCB and improved thermal management.
3Device complexity
If a single-stage voltage conversion is used, then device complexity is reduced, but voltage conversion efficiency and heat dissipation deteriorate
Solution Approach 1:
The patent segments the voltage conversion into two stages: first an isolated conversion for main power transformation, then a non-isolated conversion for precise voltage adjustment. This segmentation allows each stage to operate in its optimal efficiency range, reducing overall power loss compared to a single-stage design.
Solution Approach 2:
The patent combines two different conversion topologies (isolated and non-isolated) into a unified cascaded system. The first unit handles the bulk voltage transformation with isolation, while the second unit optimizes the voltage for the load with high efficiency, achieving better overall performance than either topology alone.
4Loss of energy
If high-parameter circuit elements are used to reduce line losses, then power supply efficiency is improved, but production costs increase
Solution Approach 1:
The patent extracts the function of high-parameter circuit elements by using a non-isolated voltage conversion unit with optimized topology. This unit achieves low line losses through its circuit architecture rather than relying on expensive high-specification components, reducing production costs while maintaining efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves power supply efficiency, reduces line losses, and decreases the requirement for high-parameter circuit elements, leading to lower production costs and increased service board capacity while effectively dissipating heat, thus addressing the challenges of power delivery and heat management in ICT devices.
Implementation Method 1
The second voltage conversion unit is connected to the first voltage conversion unit and is configured to convert the first voltage into a second voltage, and the second voltage is a power supply voltage of a first load module on the service board
Implementation Method 2
because a circuit of a non-isolated on-board power supply has a low height, whole-board heat dissipation may be performed for the on-board power supply and the load module on the service board, to improve heat dissipation efficiency of the service board
Data Source
AI summary
The power supply system includes a first voltage conversion unit, where the first voltage conversion unit is an isolated voltage conversion unit, and the first voltage conversion unit is connected to a power supply, and is configured to convert a voltage of the power supply into a power supply voltage of the service board, that is, a first voltage; and a second voltage conversion unit, where the second voltage conversion unit is a non-isolated voltage conversion unit, the second voltage conversion unit is deployed on the service board, and the second voltage conversion unit is configured to convert the first voltage into a power supply voltage of a first load module on the service board, that is, a second voltage.