Boltless Substrate Support Assembly Coupling Mechanism
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Solution Overview
Problem
Substrate processing systems face issues with plasma arcing and light-up between components of the substrate support, particularly between the conductive baseplate and other conductive structures, which can lead to inefficiencies and potential damage during etching processes.
Innovation Solution
A coupling assembly is introduced, featuring a conductive baseplate with a first cavity containing a rotating gear and pin mechanism that allows for precise alignment and attachment to an insulative baseplate, minimizing gaps and reducing arcing by ensuring secure and controlled positioning of the baseplate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate support structure is used, then the structure is simple, but plasma arcing and light-up occur between conductive components
Solution Approach 1:
An insulative baseplate is introduced as an intermediary component between the conductive baseplate and the processing chamber. This mediator prevents direct contact between conductive surfaces, eliminating the plasma arcing pathway while maintaining structural support functionality.
Solution Approach 2:
The substrate support structure is segmented into distinct functional layers: a conductive baseplate for electrical functionality, an insulative baseplate for electrical isolation, and a ceramic baseplate for thermal and mechanical support. This segmentation allows each component to perform its specific function while preventing harmful interactions.
2Reliability
If components are loosely arranged, then assembly is easy, but gaps between components cause arcing
Solution Approach 1:
The coupling assembly features nested cavities where the insulative baseplate is positioned within a cavity of the conductive baseplate, and the ceramic baseplate is positioned within a cavity of the insulative baseplate. This nesting arrangement ensures precise alignment and eliminates gaps without requiring complex external fastening mechanisms.
Solution Approach 2:
The coupling assembly merges multiple functions into a single integrated component structure that simultaneously provides alignment, positioning, and electrical isolation. The gear and pin mechanism is combined with the cavity structure to achieve both secure attachment and gap elimination.
3Reliability
If precise alignment is achieved, then arcing is reduced, but alignment precision is difficult to achieve
Solution Approach 1:
The coupling assembly is pre-configured with cavities and mechanical features that automatically guide and constrain the baseplates into precise alignment during assembly. The gear and pin mechanism is pre-positioned to engage at specific locations, ensuring repeatable alignment without requiring complex measurement or adjustment procedures.
Solution Approach 2:
The mechanical coupling mechanism is designed to self-align the baseplates through its geometric features. The pin fits into corresponding holes in the ceramic baseplate, and the gear engages with matching features, creating a self-aligning system that achieves precise positioning automatically during the assembly process.
Data Source
AI summary
A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.