Bond Pad Sharing for Magnetic Recording Head Components
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Solution Overview
Problem
Magnetic recording heads face challenges in minimizing the number of bond pads while accommodating additional electrical components, as increasing the bond pad count requires complex design changes and is costly, and sharing bond pads can lead to bias contention and performance degradation.
Innovation Solution
Implementing a switching transistor to control the powering of electrical components shared on a common bond pad, allowing for independent operation of multiple components and minimizing the number of bond pads required by sharing them between components with similar biasing and filtering requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of bond pads is increased to accommodate additional electrical components, then the components can be properly powered and connected, but the design becomes more complex and costly
Solution Approach 1:
Multiple electrical components share a common bond pad to reduce the total number of bond pads required. The patent shows components C1-C5 sharing bond pads P1-P9, where a single bond pad serves multiple components through selective biasing arrangements.
Solution Approach 2:
A single bond pad is designed to serve multiple functions by being shared among different electrical components. The common bond pad can be selectively biased to power different components based on operational requirements, making the bond pad structure universal rather than dedicated to single components.
2Device complexity
If bond pads are shared between multiple electrical components to reduce the number of bond pads, then design complexity and cost are reduced, but bias contention and performance degradation occur
Solution Approach 1:
The biasing configuration is made dynamic rather than static. Different biasing arrangements can be selectively applied to the shared bond pad depending on which component needs to operate, allowing the system to adapt its electrical configuration in real-time to prevent bias contention between components.
Solution Approach 2:
Components sharing a common bond pad are operated in alternating or periodic fashion rather than simultaneously. The system selectively activates one component at a time through controlled biasing, ensuring that only one component draws power from the shared bond pad at any given moment, thus avoiding performance degradation.
3Adaptability or versatility
If components operate simultaneously on shared bond pads, then system functionality is enhanced, but impedance mismatch and common mode noise increase
Solution Approach 1:
Components are operated in alternating time slots rather than simultaneously, with the shared bond pad being selectively biased to serve one component at a time. This periodic operation eliminates simultaneous loading that causes impedance mismatch and common mode noise while still providing full system functionality through coordinated component activation.
Data Source
AI summary
A slider of a magnetic recording head comprises a plurality of electrical bond pads coupled to bias sources and a ground pad. Each of a plurality of electrical components of the slider is coupled one or more of the electrical bond pads, wherein at least one of the electrical bond pads is a shared electrical bond pad coupled to at least a first electrical component and a second electrical component. A switching transistor is coupled to the first and second components and the ground pad. The switching transistor is arranged to control powering of the second component in response to biasing of the first component.