Electrical Connection Between Head And Arm TRIZ Cases
- Flexure Protrusion Layout for Stable Piezoelectric Head Bonding
Protrusions on the flexure confine conductive adhesive between piezoelectric electrodes, preventing shorts and stabilizing disk-head bonding.
- FPC Solder Bump Layout for Higher Height Without Bridging
A high-contact-angle covering portion confines solder on FPC pads, building taller bumps with less solder while preventing shorts.