Head Gimbal Assembly Programming via Selective Interconnect Bonding
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Solution Overview
Problem
As areal recording densities for storage discs increase, existing data storage devices face challenges in maintaining performance consistency due to process variance in magnetic recording heads, leading to variability in transducer performance.
Innovation Solution
The method involves fabricating multiple transducers with different process variances and selecting the most suitable one for operation, followed by applying specific interconnects to ensure optimal performance. This includes testing transducers using a slider dynamic electrical test to determine which transducers should be electrically coupled to a trace gimbal assembly, while others are not, thereby reducing performance variance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple transducers are fabricated into a slider to compensate for process variance, then performance consistency is improved, but device complexity increases
Solution Approach 1:
The slider is segmented to include multiple transducers (e.g., multiple write poles or read sensors) instead of a single transducer. This segmentation allows selection of the best-performing transducer during assembly, compensating for process variance and improving performance consistency across production batches.
Solution Approach 2:
Multiple transducers are fabricated with varying geometric parameters (such as pole width, gap size, or sensor dimensions) to create deliberate performance variations. During assembly, transducers are tested and the one with optimal parameters is selected and electrically connected, while others are left unconnected. This parameter variation strategy enables compensation for manufacturing process variance.
2Reliability
If transducers are tested and selected for field operation, then reliability is improved, but manufacturing time increases
Solution Approach 1:
Transducers are pre-fabricated with different geometries or characteristics during the manufacturing process, and their performance is tested before final assembly. This preliminary action allows selection of the optimal transducer early in the process, avoiding rework or field failures later, thus improving reliability while managing manufacturing time through efficient upfront testing.
3Reliability
If selective interconnect application is used to connect only tested transducers, then performance variance is reduced, but manufacturing complexity increases
Solution Approach 1:
The electrical interconnect structure is designed to selectively connect only the tested and selected transducer to the circuit board, while leaving other transducers unconnected. This extraction approach ensures that only functional, optimized transducers are integrated into the final product, reducing performance variance while maintaining manufacturing efficiency through targeted connection processes.
Data Source
AI summary
A method for programming a head gimbal assembly. The method includes building a plurality of transducers into a slider, and testing the plurality of transducers to select one of the plurality of transducers for field operation. The method also includes providing an interconnect assembly having a plurality of traces with at least one of the plurality of traces having a plurality of electrically coupled bond pads. One of the plurality of bond pads is bonded electrically to the selected transducer out of the plurality of transducers, and the other bond pads of the plurality of bond pads are not electrically coupled to any of the plurality of transducers.