Disk Device FPC Reinforcement for Heat-Induced Plate Peeling
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Solution Overview
Problem
The issue of peeling of metal reinforcing plates from the adhesive bonding them to flexible printed circuit boards (FPCs) in disk devices, such as hard disk drives (HDDs), occurs during heating processes, leading to potential delamination and damage.
Innovation Solution
The use of a bonding layer on the surface of the reinforcing plate, which enters recesses in the plate's surface, enhances the bonding force of the adhesive, preventing peeling and ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal reinforcing plate is bonded to an FPC using adhesive, then structural reinforcement is achieved, but the plate may peel off during heating processes
Solution Approach 1:
The patent applies a bonding layer to the surface of the metal reinforcing plate before bonding it to the FPC with adhesive. This preliminary action of adding the bonding layer enhances the adhesive's ability to bond to the metal surface, preventing peeling during subsequent heating processes. The bonding layer is applied in advance to prepare the surface for optimal adhesive bonding.
Solution Approach 2:
The patent creates a composite structure consisting of the FPC, adhesive, bonding layer, and metal reinforcing plate. This multi-layer composite structure combines the advantages of each material: the FPC provides flexibility, the adhesive provides bonding, the bonding layer enhances adhesion to metal, and the metal plate provides reinforcement. This composite approach resolves the peeling issue by combining materials with complementary properties.
2Ease of manufacture
If adhesive is used to bond the plate to the FPC, then assembly is simplified, but heat dissipation may be insufficient
Solution Approach 1:
The bonding layer serves as an intermediary between the adhesive and the metal reinforcing plate. While the adhesive provides the primary bonding function for easy assembly, the bonding layer acts as a thermal interface that facilitates heat transfer from the FPC to the metal plate. This intermediary layer resolves the contradiction by enabling both easy assembly through adhesive bonding and effective heat dissipation through the thermally conductive bonding layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution strengthens the adhesive bond, preventing peeling and delamination, while improving heat dissipation and reducing contamination risks, thus enhancing the reliability and manufacturing efficiency of HDDs.
Implementation Method 1
a bonding layer provided on a surface of the plate, enters a recess of the surface
Implementation Method 2
a first adhesive provided on a second surface of the FPC located opposite to the first surface
Implementation Method 3
ensuring effective heat dissipation
Data Source
AI summary
A disk device according to an embodiment includes an electronic component, a first adhesive, a plate, and a first bonding layer. The flexible printed circuit board has a first surface facing the electronic component, a second surface located opposite to the first surface, and a pad provided on the first surface and connected to the electronic component by a conductive adhesive. The first adhesive is provided on the second surface. The plate has a third surface facing the second surface. The first bonding layer is provided on the third surface, enters a recess of the third surface, and is fixed to the second surface by the first adhesive.