Flexure Wiring Spacing for Adhesive Flow Control
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Solution Overview
Problem
In disk devices, such as hard disk drives, the adhesive used to mount electronic components on a flexible flexure can flow out of a recessed groove due to capillary phenomena, leading to unintended placement and potential contamination, which affects the mechanical properties and cleanliness of the device.
Innovation Solution
The flexure design includes a first portion where the wiring patterns extend side by side with a constant distance, and a second portion closer to the adhesive with a larger distance between the wiring patterns, which inhibits the adhesive from flowing out by increasing the width of the groove, thereby retaining the adhesive and preventing it from reaching the first portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring patterns are provided on the flexure surface, then electrical connection is achieved, but adhesive flows out along the groove due to capillary phenomenon
Solution Approach 1:
The patent applies local quality by creating a groove only in the region where adhesive is applied, while leaving the wiring pattern regions intact. This localized groove structure allows adhesive to be contained in specific areas without interfering with the electrical connectivity provided by the wiring patterns elsewhere on the flexure surface.
Solution Approach 2:
The flexure surface is segmented into distinct regions: wiring pattern regions and adhesive application regions. The groove is formed only in the adhesive application regions, separating the adhesive flow path from the wiring patterns. This segmentation prevents adhesive from flowing along the wiring patterns while maintaining electrical connection integrity.
2Ease of manufacture
If adhesive is applied to mount electronic components, then component attachment is achieved, but adhesive contaminates the flexure surface
Solution Approach 1:
The harmful adhesive flow is extracted and contained within the groove structure. By forming a groove that receives and contains the adhesive, the patent separates the adhesive from the surrounding flexure surface, preventing contamination while maintaining the adhesive's function in attaching electronic components.
Solution Approach 2:
The groove acts as an intermediary structure between the adhesive and the flexure surface. It provides a dedicated space for adhesive to flow and be contained, mediating between the need for adhesive application and the need to prevent contamination of the flexure surface.
3Ease of manufacture
If constant distance between wiring patterns is maintained, then manufacturing simplicity is achieved, but adhesive flow control is insufficient
Solution Approach 1:
The patent maintains constant distance between wiring patterns in the overall layout for manufacturing simplicity, but locally modifies the structure by forming grooves only in specific adhesive application regions. This allows adhesive flow control to be implemented locally without complicating the overall wiring pattern fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively controls the range of adhesive flow, maintaining the mechanical properties and cleanliness of the flexure, preventing contamination and ensuring proper posture control of the magnetic head.
Implementation Method 1
a recessed groove may be formed on the surface of the flexure between two wiring patterns. There is a possibility that the adhesive flows out to an unexpected range along the groove due to, for example, a capillary phenomenon.
Data Source
AI summary
According to one embodiment, a disk device includes a recording medium, electronic components including a magnetic head, a flexure, and an adhesive. The flexure includes a surface on which the electronic component is mounted, a first wiring and a second wiring each extending along the surface, and a groove provided on the surface between the first/second wirings. The adhesive is in contact with an inner surface of the groove and includes an adhesive portion attaching the electronic component to the surface. A first portion in the flexure is provided in a position apart from the electronic component. A second portion in the flexure is positioned closer to the adhesive portion than the first portion. A distance between the first wiring and the second wiring is larger than that in the first portion.