Shared Bond Pad Configuration for Recording Head Components
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Solution Overview
Problem
Data storage systems face challenges in minimizing the number of bond pads on recording transducers due to space constraints and increased complexity when adding additional components, leading to issues like bias contention and degraded performance.
Innovation Solution
Implementing a shared bond pad configuration between electrical components with similar biasing and filtering requirements, utilizing diodes to control component energization based on polarity, allowing multiple components to operate independently and minimizing the number of bond pads required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional electrical components are added to the recording transducer, then the functionality and performance of the data storage system is improved, but the number of bond pads required increases leading to space constraints and design complexity
Solution Approach 1:
The patent applies universality by enabling a single bond pad to serve multiple electrical components through the implementation of diode-based switching circuits. The shared bond pad can be dynamically assigned to different components (e.g., heater, reader, writer) based on operational requirements, allowing one physical bond pad to fulfill the electrical connection needs of multiple components without requiring separate dedicated pads for each component.
2Area of stationary object
If the number of bond pads is reduced to minimize real estate, then space constraints are alleviated, but bias contention and degraded performance occur
Solution Approach 1:
The patent implements dynamics by using diode-based circuits that dynamically switch the connection between the shared bond pad and different electrical components based on the polarity of the applied voltage. During different operational phases (e.g., heating, reading, writing), the diodes automatically route current to the appropriate component, ensuring that only one component is active at a time on the shared pad. This dynamic switching prevents bias contention and maintains reliable performance while reducing the total number of bond pads required.
3Area of stationary object
If bond pads are shared between multiple components, then the real estate needed for bond pads is reduced, but the complexity of controlling component energization increases
Solution Approach 1:
The patent applies self-service by utilizing the inherent polarity characteristics of the bias voltage applied to the shared bond pad to automatically control which component is energized. The diode-based circuits are configured such that the polarity of the applied voltage directly determines the conduction state of each diode, enabling automatic component selection without requiring external control signals or complex switching logic. The system essentially controls itself by leveraging the natural electrical properties of the components and the diodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the real estate needed for bond pads, maintains performance by mitigating bias contention, and simplifies design complexity by enabling efficient sharing of bond pads between components that operate at different times or alternately.
Implementation Method 1
At least one diode is coupled to at least one of the electrical bond pads and at least one of the electrical components. At least some of the diodes are arranged to conduct alternately depending on the polarity of the one electrical bond pad relative to the ground pad.
Data Source
AI summary
An apparatus includes a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad. Each of a plurality of electrical components of the slider is coupled to at least one of the electrical bond pads. At least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components. At least one diode is coupled to at least one of the electrical bond pads and at least one of the electrical components.