Suspension Wiring Tail Connector Structure for Reliable Solder Adhesion

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Solution Overview

Problem

The insulating layers in the suspension assembly hinder the solder from adhering to the connection terminal, reducing the reliability of the connection between the flexible printed circuit board and the magnetic head.

Innovation Solution

A suspension assembly design with a conductive layer interposed between insulating layers, reinforced by protrusions that cover the connection terminal, allowing for improved solder adhesion and connection reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If insulating layers cover the connection terminal for reinforcement, then the connection terminal is strengthened, but the solder cannot adhere to the connection terminal

Engineering Contradiction:
Improveconnection terminal strengthVSAvoidsolder adhesion reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The insulating layer is segmented into different regions: a first insulating region that covers the connection terminal for reinforcement, and a second insulating region that is removed or reduced to expose the connection terminal surface for solder adhesion. This segmentation allows the same insulating layer to serve dual purposes of strengthening and enabling solder attachment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulating layer has different properties in different locations: it provides full coverage and reinforcement in areas where structural strength is needed, while having reduced coverage or different material composition in areas where solder adhesion is required. This local differentiation resolves the contradiction between reinforcement and solder accessibility.

Inventive Principle:
Principle #3Local quality

2Length of moving object

If the conductive layer is decreased in thickness to reduce connection terminal thickness, then the connection terminal is thinner, but the insulating layers may hinder solder adhesion

Engineering Contradiction:
Improveconnection terminal thicknessVSAvoidsolder adhesion reliability
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The insulating layer is prepared in advance with predetermined patterns of coverage and exposure. The areas where solder adhesion is needed are pre-configured to have reduced insulating material, ensuring that when soldering occurs, the connection terminal surface is already accessible despite the overall thinness of the connection terminal structure.

Inventive Principle:
Principle #10Preliminary action

3Area of stationary object

If solder is allowed to spread freely during bonding, then the solder can cover larger areas, but the solder may spread to adjacent terminals causing short circuits

Engineering Contradiction:
Improvesolder coverage areaVSAvoidelectrical connection reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The insulating layer is configured to create physical barriers between adjacent connection terminals. These insulating structures are positioned to prevent solder from spreading laterally to neighboring terminals during the soldering process, thus preemptively avoiding short circuits while still allowing sufficient solder coverage on each individual terminal.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances the connection reliability by ensuring sufficient solder adhesion and prevents solder from spreading to adjacent terminals, improving the electrical connection between the flexible printed circuit board and the magnetic head.

Implementation Method 1

The wiring member includes two insulating layers and a conductive layer interposed between the two insulating layers

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

Connection terminals of the conductive layer are bonded to FPC pads using solder

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS12603107B2Suspension assembly and disk device having wiring member
Publication Date: 2026.04.14 KK TOSHIBA
  • US12603107B2 patent drawing
  • US12603107B2 patent drawing
  • US12603107B2 patent drawing

AI summary

According to one embodiment, a suspension assembly includes a wiring member. The tail connector of the wiring member includes a base layer, a cover layer, and a conductive layer interposed between the base layer and the cover layer. The cover layer includes a groove. The conductive layer includes a first wire, a second wire, and a connection terminal extending between the first wire and the second wire across the groove. The base layer includes a first base covering the first wire, a second base covering the second wire first protrusion pair protruding from the first base to partially cover the connection terminal, and second protrusion pair protruding from the second base to partially cover the connection terminal.