HGA Flexure Conductive Trace Routing for Pin-Out Freedom
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Solution Overview
Problem
Current flexure designs in disk drives face limitations in electrical connectivity due to constrained conductive trace routing patterns, which restrict the pin-out configuration of the flex cable and pre-amp, especially in smaller form factor drives where area for rerouting is limited.
Innovation Solution
A head gimbal assembly with a flexure featuring patterned conductive traces on a dielectric layer between the slider and a metal backing layer, allowing for flexible routing and connection configurations that are not restricted by standard trace ordering, enabling more freedom in electrical connectivity between the head and pre-amp.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard conductive trace routing configuration is used, then electrical connectivity is established, but pin-out configuration freedom is limited
Solution Approach 1:
The patent transitions from planar trace routing to three-dimensional routing by utilizing multiple layers (first conductive layer, second conductive layer) and vertical vias. This allows traces to route in different spatial dimensions, enabling flexible pin-out configurations without being constrained by two-dimensional trace ordering rules.
Solution Approach 2:
The conductive traces are divided into multiple segments across different layers. The first conductive traces are routed on a first conductive layer while second conductive traces are routed on a second conductive layer, with vertical vias connecting them. This segmentation allows independent routing of different signal paths without interference.
2Ease of operation
If conductive traces are disposed in a common plane, then routing is simplified, but electrical connectivity flexibility is reduced
Solution Approach 1:
The patent moves from two-dimensional planar routing to three-dimensional multi-layer routing. Conductive traces are distributed across multiple conductive layers with vertical vias providing connections between layers, enabling flexible electrical connectivity while maintaining relatively simple routing within each layer.
3Ease of manufacture
If trace routing is constrained by standard ordering, then manufacturing is simplified, but design adaptability is limited
Solution Approach 1:
The patent segments conductive traces into multiple layers, allowing different trace ordering and routing patterns in each layer. This segmentation enables design adaptability for different pin-out configurations while maintaining manufacturing simplicity through standardized multi-layer processing techniques.
Solution Approach 2:
By utilizing vertical vias and multiple conductive layers, the patent enables flexible design adaptability without significantly complicating manufacturing. The multi-layer structure allows standard fabrication processes to produce varied routing configurations through controlled layer stacking and via placement.
Data Source
AI summary
There is provided a head gimbal assembly (HGA) for a disk drive. The HGA includes a slider and a flexure. The slider includes first, second and third electrically conductive pads disposed upon a trailing side. The first electrically conductive pad is disposed between the second and third electrically conductive pads. The flexure includes first, second, and third patterned conductive traces respectively electrically connected to the first, second, and third electrically conductive pads. The first patterned conductive trace is disposed between the second and third patterned conductive traces in a flexure body portion.